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Electronic Packaging Materials Science VIII

Electronic Packaging Materials Science VIII

Volume 390

$39.99 (C)

Part of MRS Proceedings

  • Date Published: September 1995
  • availability: Temporarily unavailable - available from TBC
  • format: Hardback
  • isbn: 9781558992931

$39.99 (C)

Temporarily unavailable - available from TBC
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About the Authors
  • The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.

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    Product details

    • Date Published: September 1995
    • format: Hardback
    • isbn: 9781558992931
    • weight: 0.591kg
    • availability: Temporarily unavailable - available from TBC
  • Editors

    Peter Børgesen, Universal Instruments Corporation, Binghamton

    Kenneth A. Jackson, University of Arizona

    Robert C. Sundahl, Intel Corporation, Chandler

    King-Ning Tu, University of California, Los Angeles

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