Hostname: page-component-848d4c4894-x5gtn Total loading time: 0 Render date: 2024-05-24T02:06:19.668Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate

Published online by Cambridge University Press:  04 December 2017

Jung-Kwon Yang ,
Young-Joo Lee ,
Seol-Min Yi ,
Byoung-Joon Kim  and
Young-Chang Joo
Jung-Kwon Yang
Affiliation:
Department of Materials Science & Engineering, Seoul National University, Seoul 08826, Korea
Young-Joo Lee
Affiliation:
Department of Materials Science & Engineering, Seoul National University, Seoul 08826, Korea
Seol-Min Yi
Affiliation:
Research Institute of Advanced Materials, Seoul National University, Seoul 08826, Korea
Byoung-Joon Kim*
Affiliation:
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk-do 36729, Korea
Young-Chang Joo*
Affiliation:
Department of Materials Science & Engineering, Seoul National University, Seoul 08826, Korea
*
a) Address all correspondence to these authors. e-mail: bjkim@anu.ac.kr
b) e-mail: ycjoo@snu.ac.kr
Get access

Abstract

To secure the reliability of flexible electronics, the effect of multicomponent stress on the device properties during complex mechanical deformation needs to be thoroughly understood. The electrical resistances of metal interconnects are investigated by in situ monitoring at different twisting angles and with different pattern positions. As the twisting angle increased, the electrical resistance increased earlier. Furthermore, in the line pattern located far from the central axis, severe electrical degradation and fatigue damage formation were observed. Multicomponent stress evolution during twisting was analyzed by the finite-element simulation method. For easy practical application for estimating the representative twisting strain, an analytic solution of twisting deformation was formulated and compared with the simulation. Using the equivalent strain, the fatigue lifetime was fitted, and the exponents were obtained for lifetime expectation. This systematic study provides the guidelines for highly reliable flexible devices and the tools for determining the expected fatigue lifetime.

Keywords

metalfatiguefilm
Type
Articles
Information
Journal of Materials Research , Volume 33 , Issue 2 , 29 January 2018 , pp. 138 - 148
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: C. Robert Kao

References

REFERENCES

Huang, X., Liu, Y., Cheng, H., Shin, W-J., Fan, J.A., Liu, Z., Lu, C-J., Kong, G-W., Chen, K., Patnaik, D., Lee, S-H., Hage-Ali, S., Huang, Y., and Rogers, J.A.: Materials and designs for wireless epidermal sensors of hydration and strain. Adv. Funct. Mater. 24, 3846–3854 (2014).Google Scholar
Liu, Q.C., Xu, J.J., Xu, D., and Zhang, X.B.: Flexible lithium-oxygen battery based on a recoverable cathode. Nat. Commun. 6, 7892 (2015).CrossRefGoogle ScholarPubMed
Kim, S., Kwon, H.J., Lee, S., Shim, H., Chun, Y., Choi, W., Kwack, J., Han, D., Song, M., Kim, S., Mohammadi, S., Kee, I., and Lee, S.Y.: Low-power flexible organic light-emitting diode display device. Adv. Mater. 23, 3511–3516 (2011).CrossRefGoogle ScholarPubMed
Li, Y., Lee, D-K., Kim, J.Y., Kim, B., Park, N-G., Kim, K., Shin, J-H., Choi, I-S., and Ko, M.J.: Highly durable and flexible dye-sensitized solar cells fabricated on plastic substrates: PVDF-nanofiber-reinforced TiO2 photoelectrodes. Energy Environ. Sci. 5, 8950 (2012).Google Scholar
Zhu, X., Zhang, B., Gao, J., and Zhang, G.: Evaluation of the crack-initiation strain of a Cu–Ni multilayer on a flexible substrate. Scr. Mater. 60, 178–181 (2009).Google Scholar
Lee, J-H., Kim, N-R., Kim, B-J., and Joo, Y-C.: Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with oxygen-pressure-controlled annealing. Carbon 50, 98–106 (2012).Google Scholar
Kim, B-J., Shin, H-A.S., Lee, J-H., Yang, T-Y., Haas, T., Gruber, P., Choi, I-S., Kraft, O., and Joo, Y-C.: Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates. J. Mater. Sci. 29, 2827–2834 (2014).Google Scholar
Lee, Y-J., Shin, H-A.S., Nam, D-H., Yeon, H-W., Nam, B., Woo, K., and Joo, Y-C.: Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer. Electron. Mater. Lett. 11, 149–154 (2015).CrossRefGoogle Scholar
Glushko, O., Klug, A., List-Kratochvil, E.J.W., and Cordill, M.J.: Relationship between mechanical damage and electrical degradation in polymer-supported metal films subjected to cyclic loading. Mater. Sci. Eng., A 662, 157–161 (2016).Google Scholar
Akinwande, D., Petrone, N., and Hone, J.: Two-dimensional flexible nanoelectronics. Nat. Commun. 5, 5678 (2014).Google Scholar
Lee, P., Lee, J., Lee, H., Yeo, J., Hong, S., Nam, K.H., Lee, D., Lee, S.S., and Ko, S.H.: Highly stretchable and highly conductive metal electrode by very long metal nanowire percolation network. Adv. Mater. 24, 3326–3332 (2012).Google Scholar
Kim, B.J., Cho, Y., Jung, M.S., Shin, H.A., Moon, M.W., Han, H.N., Nam, K.T., Joo, Y.C., and Choi, I.S.: Fatigue-free, electrically reliable copper electrode with nanohole array. Small 8, 3300–3306 (2012).Google Scholar
Moon, G.D., Lim, G.H., Song, J.H., Shin, M., Yu, T., Lim, B., and Jeong, U.: Highly stretchable patterned gold electrodes made of Au nanosheets. Adv. Mater. 25, 2707–2712 (2013).Google Scholar
Zhang, Y., Fu, H., Su, Y., Xu, S., Cheng, H., Fan, J.A., Hwang, K-C., Rogers, J.A., and Huang, Y.: Mechanics of ultra-stretchable self-similar serpentine interconnects. Acta Mater. 61, 7816–7827 (2013).CrossRefGoogle Scholar
Hsu, Y-Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., and De Wolf, I.: The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit. J. Micromech. Microeng. 20, 075036 (2010).Google Scholar
Gonzalez, M., Axisa, F., Bulcke, M.V., Brosteaux, D., Vandevelde, B., and Vanfleteren, J.: Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48, 825–832 (2008).Google Scholar
Zhou, R., Guo, W., Yu, R., and Pan, C.: Highly flexible, conductive and catalytic Pt networks as transparent counter electrodes for wearable dye-sensitized solar cells. J. Mater. Chem. A 3, 23028–23034 (2015).CrossRefGoogle Scholar
Yoon, S.G., Koo, H.J., and Chang, S.T.: Highly stretchable and transparent microfluidic strain sensors for monitoring human body motions. ACS Appl. Mater. Interfaces 7, 27562–27570 (2015).Google Scholar
Cho, D-Y., Eun, K., Choa, S-H., and Kim, H-K.: Highly flexible and stretchable carbon nanotube network electrodes prepared by simple brush painting for cost-effective flexible organic solar cells. Carbon 66, 530–538 (2014).CrossRefGoogle Scholar
Song, S., Jang, J., Ji, Y., Park, S., Kim, T-W., Song, Y., Yoon, M-H., Ko, H.C., Jung, G-Y., and Lee, T.: Twistable nonvolatile organic resistive memory devices. Org. Electron. 14, 2087–2092 (2013).Google Scholar
Lu, N., Suo, Z., and Vlassak, J.J.: The effect of film thickness on the failure strain of polymer-supported metal films. Acta Mater. 58, 1679–1687 (2010).Google Scholar
Yu, D.Y.W. and Spaepen, F.: The yield strength of thin copper films on Kapton. J. Appl. Phys. 95, 2991–2997 (2004).CrossRefGoogle Scholar
Suresh, S.: Fatigue of Materials, 2nd ed. (Cambridge University Press, Cambridge, 1999); pp. 133–222.Google Scholar
Dieter, G.E.: Mechanical Metallurgy (McGraw-Hill Book Company, London, 1988); pp. 381–419.Google Scholar
Kim, B-J., Shin, H-A.S., Jung, S-Y., Cho, Y., Kraft, O., Choi, I-S., and Joo, Y-C.: Crack nucleation during mechanical fatigue in thin metal films on flexible substrates. Acta Mater. 61, 3473–3481 (2013).CrossRefGoogle Scholar
Li, Y., Wang, X-S., and Meng, X-K.: Buckling behavior of metal film/substrate structure under pure bending. Appl. Phys. Lett. 92, 131902–131903 (2008).CrossRefGoogle Scholar
Toth, F., Rammerstorfer, F.G., Cordill, M.J., and Fischer, F.D.: Detailed modelling of delamination buckling of thin films under global tension. Acta Mater. 61, 2425–2433 (2013).Google Scholar
Shames, I.H. and Pitarresi, J.M.: Introducion to Solid Mechanics, 3rd ed. (Pearson Education, New Delhi, 2000); pp. 513–554.Google Scholar
Gupta, R. and Siller, T.S.: Stress distribution in structural composite lumber under torsion. For. Prod. J. 55, 51–56 (2005).Google Scholar
Huang, H. and Spaepen, F.: Tensile testing of free-standing Cu, Ag, and Al thin films and Ag/Cu multilayers. Acta Mater. 48, 3261–3269 (2000).Google Scholar
Xiang, Y. and Vlassak, J.J.: Bauschinger effect in thin metal films. Scr. Mater. 53, 177–182 (2005).Google Scholar
Trahair, N.S.: Nonlinear elastic nonuniform torsion. J. Struct. Eng. 131, 1135–1142 (2005).CrossRefGoogle Scholar
Coffin, L.F.: A study of the effects of cyclic thermal stresses on a ductile metal. Trans. ASME. 76, 931–950 (1954).Google Scholar
Manson, S.S.: Behavior of Materials Under Conditions of Thermal Stress; Report 1170; Lewis Flight Propulsion Laboratory: Cleveland, OH, 1954.Google Scholar
Kraft, O., Schwaiger, R., and Wellner, P.: Fatigue in thin films: Lifetime and damage formation. Mater. Sci. Eng., A 319–321, 919–923 (2001).Google Scholar
Sun, X.J., Wang, C.C., Zhang, J., Liu, G., Zhang, G.J., Ding, X.D., Zhang, G.P., and Sun, J.: Thickness dependent fatigue life at microcrack nucleation for metal thin films on flexible substrates. J. Phys. D: Appl. Phys. 41, 195404 (2008).Google Scholar
Basquin, O.H.: The exponential law of endurance tests. Proc. ASTM 10, 625–630 (1910).Google Scholar