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Layered in situ copper/polyimide composite films

Published online by Cambridge University Press:  31 January 2011

G. M. Porta  and
L. T. Taylor
G. M. Porta
Affiliation:
Department of Chemistry, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061-0699
L. T. Taylor
Affiliation:
Department of Chemistry, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061-0699
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Abstract

Incorporation of bis (trifluoroacetylacetonato) copper (II), Cu (TFA)2 into poly (amide acid) prior to imidization produces bi-and trilayered composite films upon curing. Choice of curing atmosphere and concentration of dopant control the formation of a particular layered structure. Dry air and 100% relative humidity are the curing atmospheres used. The trilayered films are typified by a zero-valent copper layer sandwiched between a thin polyimide overlayer and the bulk polyimide. Curing in 100% relative humidity produces the thinnest overlayer. By doubling the dopant concentration used to prepare the trilayered films, bilayered films will result upon curing. In this instance the lack of a polyimide overlayer affords the oxidation of copper at the surface to copper (II) oxide. In each case the formation of the copper layer results from the migration of all Cu (TFA)2 from a depth of approximately 2000 Å to the surface where subsequent reactions take place. Several [Auger electron spectroscopy (AES), x-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM)] analytical techniques are used to characterize the physical and chemical nature of the films.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 3 , Issue 2 , April 1988 , pp. 211 - 214
Copyright
Copyright © Materials Research Society 1988

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References

1Metal-Filled Polymers Properties and Applications, edited by Bhattacharya, S. K. (Dekker, New York, 1986).Google Scholar
2Angelo, R. J. and DuPont, E. I. DeNemours and Co., U. S. Patent No. 3,073,785(1959).Google Scholar
3Ezzell, S. A., Furtsch, T. A., Khor, E., and Taylor, L. T., J. Polym. Sci. Polym. Chem. Ed. 21, 865 (1983).CrossRefGoogle Scholar
4Boggess, R. K. and Taylor, L. T., J. Polym. Sci. Polym. Chem. Ed. 25, 685 (1987).CrossRefGoogle Scholar
5Rancourt, J. D., Boggess, R. K., Horning, L. S., and Taylor, L. T., J. Electrochem. Soc. 134, 85 (1987).CrossRefGoogle Scholar
6Madeleine, D. G., Spillane, S. A., and Taylor, L. T., J. Vac. Sci. Tech-nol. A 5, 347 (1987).CrossRefGoogle Scholar