Hostname: page-component-848d4c4894-wzw2p Total loading time: 0 Render date: 2024-06-02T04:41:44.251Z Has data issue: false hasContentIssue false
  • English
  • Français

A new solder wetting layer for Pb-free solders

Published online by Cambridge University Press:  31 January 2011

Chang Yul Oh ,
Hee-Ra Roh ,
Young Min Kim ,
Jin Soo Lee ,
Hae Young Cho  and
Young-Ho Kim
Young-Ho Kim*
Affiliation:
Division of Materials Science & Engineering, Hanyang University, Seoul 133-791, Korea
*
a) Address all correspondence to this author. e-mail: kimyh@hanyang.ac.kr
Get access

Abstract

We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.

Keywords

AlloyCuZn
Type
Rapid Communications
Information
Journal of Materials Research , Volume 24 , Issue 2 , February 2009 , pp. 297 - 300
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.: Properties of lead-free solder alloy with rare earth element additions. Mater. Sci. Eng., R 44, 1 (2004)CrossRefGoogle Scholar
2.Laurila, T., Vuorinen, V., Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Rep. 49, 1 (2005)CrossRefGoogle Scholar
3.Anderson, I.E., Foley, J.C., Cook, B.A., Harringa, J., Terpstra, R.L., Unal, O.: Alloying effect in near-eutectic Sn–Ag–Cu solder alloys for improved microstructural stability. J. Electron. Mater. 30, 1050 (2001)CrossRefGoogle Scholar
4.Tsay, L-W., Lin, C-L., Ou, J-L., Shiue, R-K.: A study of Sn–Bi–Ag–(In) lead-free solder. J. Mater. Sci. 38, 1269 (2003)Google Scholar
5.Lee, T.Y., Choi, W.J., Tu, K.N.: Morphology, kinetics and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002)CrossRefGoogle Scholar
6.Xu, L., Pang, J.H.L.: Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free solder BGA solder joint, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)275Google Scholar
7.Choi, W.K., Lee, H.M.: Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn–3.5Ag solder alloy and Cu substrate. J. Electron. Mater. 29, 1207 (2000)CrossRefGoogle Scholar
8.Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002)CrossRefGoogle Scholar
9.Kang, S.K., Choi, W.K., Shih, D-Y., Henderson, D.W., Gosselin, T., Sarkhel, A., Goldsmith, C., Puttlitz, K.J.: Formation of Ag3Sn plates in Sn–Ag–Cu alloys and optimization of their alloy composition, in Proc. 53rd Electronic Component on Technology ConferenceNew Orleans, LA 2003)64Google Scholar
10.Kang, S.K., Leonard, D., Shih, D-Y., Gignac, L., Henderson, D.W., Cho, S., Yu, J.: Interfacial reactions of Sn–Ag–Cu solders modified by minor Zn alloying addition. J. Electron. Mater. 35, 479 (2006)CrossRefGoogle Scholar
11.Kang, S.K., Shih, D-Y., Leonard, D., Henderson, D.W., Gosselin, T., Cho, S., Yu, J., Choi, W.K.: Controlling Ag3Sn plate formation in near-ternary-eutectic Sn–Ag–Cu solder by minor Zn alloying. JOM 56, 34 (2004)CrossRefGoogle Scholar
12.Wang, F., Ma, X., Qian, Y.: Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount Zn addition. Scr. Mater. 53, 699 (2005)CrossRefGoogle Scholar
13.Zeng, K., Stierman, R., Chiu, T-C., Edward, D., Ano, K., Tu, K.N.: Kirkendall void formation in eutectic Sn–Pb solder joint on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005)CrossRefGoogle Scholar
14.Vianco, P.T., Rejent, J.A., Hlava, P.F.: Solid-state intermetallic compound layer growth between copper and 95.5Sn–3.9Ag–0.6Cu solder. J. Electron. Mater. 33, 991 (2004)CrossRefGoogle Scholar
15.de Souas, I., Henderson, D.W., Patry, L., Kang, S.K., Shih, D-Y.: The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structure, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)1454Google Scholar
16.Kim, T.H., Kim, Y-H.: Sn–Ag–Cu and Sn–Cu solder: Interfacial reactions with platinum. JOM 56, 45 (2004)CrossRefGoogle Scholar
17.Choi, W.K., Sohn, Y.C., Moon, C.Y., Roh, H.R., Oh, C.Y., Kim, Y-H.: Intermetallic compound formation at the interface between Sn–3.0Ag–0.5Cu solder alloy and Cu-Zn alloy substrate, in Proc. 2007 International Conference on Electronic PackagingTokyo 2007)Google Scholar
18.Feng, W., Wang, C., Morinaga, M.: Electronic structure mechanism for the wettability of Sn-based solder alloys. J. Electron. Mater. 31, 185 (2002)CrossRefGoogle Scholar
19.Jee, Y.K., Ko, Y-H., Yu, J.: Effect of Zn on the intermetallic formation and reliability of Sn–3.5Ag solder on a Cu pad. J. Mater. Res. 22, (7), 1879 (2007)CrossRefGoogle Scholar
20.Oh, C.Y., Roh, H.R., Kim, Y-H.: Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu–Zn UBM, in Proc. 40th International Microelectronic and Packaging SocietySan Jose, CA 2007)48Google Scholar