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Shearing tests of solder joints on tape ball grid array substrates

Published online by Cambridge University Press:  03 March 2011

B.Y. Wu ,
H.W. Zhong ,
Y.C. Chan  and
M.O. Alam
B.Y. Wu
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China
H.W. Zhong
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China
Y.C. Chan*
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China
M.O. Alam
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China
*
a) Address all correspondence to this author. e-mail: eeycchan@cityu.edu.hk
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Abstract

Shearing behavior of Sn-37Pb, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-8 in solder joints on tape ball grid array (TBGA) substrates were investigated with different shearing speeds from 7 μm/s to 700 μm/s and over a wide temperature range from −25 °C to 150 °C. Both shearing speed and testing temperature were found to have strong effects on the shearing strength and fracture mechanisms of the solder joints. At certain temperature, the shearing force increases sharply with the increase of shearing speed due to a small amount of grain boundary deformation and incomplete dislocation movement as well as more work hardening at a high strain rate. With a fixed speed, the shearing force decreases dramatically with the increase of shearing temperature as a result of a small amount of work hardening and more dynamic recovery, as well as a reduction in Young’s modulus at elevated temperatures. Two lead-free solder joints were much stronger than the tin-lead solder joints under any given shearing condition. At a low temperature of −25 °C, the tin-lead solder joints failed with a combination of intermetallic compounds (IMC) fracture and solder/IMC interface detachment, whereas both lead-free solder joints failed by IMC/Ni interfacial separation. From 25 °C to 150 °C, the fracture mode of all solder joints was complete ball cut through the bulk solder with a ductile rupture. The underlying mechanisms for different shearing performance are interpreted in relation to the properties of the interconnecting materials.

Keywords

FractureMicroelectronicsSoldering
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 9 , September 2006 , pp. 2224 - 2231
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1Andros, F.E. and Hammer, R.B.: TBGA package technology, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 17, 1994, pp. 564–568.CrossRefGoogle Scholar
2Kim, D.G., Kim, J.W., and Jung, S.B.: Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni-P UBM. Mater. Sci. Eng., B 121, 204 (2005).CrossRefGoogle Scholar
3Zhong, C.H., Yi, S., Mui, Y.C., Howe, C.P., Olsen, D., and Chen, W.T.: Missing solder ball failure mechanisms in plastic ball grid array packages, in Proceedings of 50th Electronic Component Technology Conference (21–24 May, 2000, Las Vegas, NV), pp. 151–159.Google Scholar
4Li, M., Zhang, F., Chen, W.T., Zeng, K., Tu, K.N., Balkan, H., and Elenius, P.: Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films. J. Mater. Res. 17, 1612 (2002).CrossRefGoogle Scholar
5Alam, M.O., Chan, Y.C., and Tu, K.N.: Effect of reaction time and P-content on mechanical strength of the interfaces formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 94, 4108 (2003).CrossRefGoogle Scholar
6Chong, V., Lee, T.K., Lim, C.T., and Gunawan, D.K.: Effects of ball pad configuration on joint reliability in BGA chip-scale packages in Electronics Packaging Technology Conference, Proceedings of 6th EPTC (8–10 Dec, 2004, Singapore), pp. 735–739.Google Scholar
7Kim, S.W., Yoon, J.W., and Jung, S.B.: Interfacial reactions and shear strengths between Sn-Ag based Pb-free solder balls and Au/EN/Cu metallization. J. Electron. Mater. 33, 1182 (2004).CrossRefGoogle Scholar
8Yoon, J.W., Kim, S.W., and Jung, S.B.: Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. J. Alloys Compd. 391, 82 (2005).CrossRefGoogle Scholar
9Anderson, I.E. and Harringa, J.L.: Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength. J. Electron. Mater. 33, 1485 (2004).CrossRefGoogle Scholar
10Huang, X.J., Lee, S.W.R, and Yan, C.C.: Characterization and analysis on the solder ball shear testing conditions in Electronic Components and Technology Conference, Proceedings of the 52nd ECTC (28–31 May, 2002, CA), pp. 968–973.Google Scholar
11Erich, R., Richard, J.C., Wenger, G.M., and Primavera, A.: Shear testing and failure mode analysis for evaluation of BGA ball attachment in Proceedings of the 24th IEEE/CPMT International Electronics Manufacturing Symposium (18–19 Oct, 1999, Austin, TX), pp. 16–22.Google Scholar
12Lim, A.C.P., Kheng, L.T., Alamsjah, A., and Happy, : The effect of ball pad designs and substrate materials on the performance of second-level interconnects in Electronics Packaging Technology Conference, Proceedings of 5th EPTC (10-12 Dec, 2003, Pan Pacific Hotel, Singapore), pp. 563–568.Google Scholar
13Anand, A., Mui, Y.C., Weidier, J., and Diaz, N.: Impact of substrate finish on Sn/Ag/Cu alloy solder joint in Electronics Packaging Technology Conference Proceedings of 6th EPTC (8–10 Dec, 2004, Pan Pacific Hotel, Singapore), pp. 335–338.Google Scholar
14Lee, S.W.R. and Huang, X.J.: Analysis on solder ball shear testing conditions with a. simple computational model Soldering & Surface Mount Technology, Vol. 14, 4548(2002).Google Scholar
15Kim, J.W., Joo, J., Quesnel, D.J., and Jung, S.B.: Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints. Mater. Sci. Technol. 21, 373 (2005).CrossRefGoogle Scholar
16Shi, X.Q., Zhou, W., Pang, H.L.J., and Wang, Z.P.: Effect of temperature and strain rate on mechanical. properties of 63Sn/37Pb solder alloy. ASME Journal of Electronic Packaging 121, 179 (1999).CrossRefGoogle Scholar
17Hwang, J.S.: Environment-Friendly Electronics: Lead-Free Technology (Electrochemical Publications, New York, 2001) 277–293.Google Scholar
18Dieter, G.E.: Mechanical Metallurgy (McGraw-Hill, New York, 1988) 139–144296–301.Google Scholar
19Kim, J.W. and Jung, S.B.: Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints. Mater. Sci. Eng., A 371, 267 (2004).CrossRefGoogle Scholar
20Borsutzki, M., Cornette, D., Kuriyama, Y., Uenishi, A., Yan, B., and Opbroek, E.: Recommendations for Dynamic Tensile Testing of Sheet Steels, Available online at: http://www.worldautosteel.org/pdf_hsrt/DynTestingRecomPract.pdf.Google Scholar
21 Materials Performance Group, National Institute of Standards and Technology (NIST), USA.: Torsion and Tension Behavior, Available online at: http://www.metallurgy.nist.gov/mechanical_properties/solder_tension_torsion.html.Google Scholar
22Siewert, T., Liu, S., Smith, D.R., and Madeni, J.C.: Database for Solder Properties with Emphasis on New Lead-free Solders, 2002, Available online at: http://www.boulder.nist.gov/div853/lead%20free/solders.html.Google Scholar
23Pang, H.L.J., Tan, K.H., Shi, X.Q., and Wang, Z.P.: Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging. Mater. Sci. Eng., A 307, 42 (2001).CrossRefGoogle Scholar
24Shin, C.K., Baik, Y.J., and Huh, J.Y.: Effects of microstructural evolution and intermetallic layer growth on shear strength of ball grid array Sn-Cu solder joints. J. Electron. Mater. 30, 1323 (2001).CrossRefGoogle Scholar