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Thermal transfer printing technique for electrode patterning in cofired ceramic multi-layer devices

Published online by Cambridge University Press:  03 March 2011

Kumi Okuwada  and
Tetsuo Okuyama
Kumi Okuwada
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
Tetsuo Okuyama
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
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Abstract

A new mask-less electrode patterning method using a thermal transfer printing technique was investigated. Thermal ink ribbons were prepared, which included more than 50 vol. % conductive metal powder. Arbitrary electrode patterns were designed with a computer and printed out on a ceramic green sheet with a serial thermal printer. The ceramic green sheets with printed electrode patterns were stacked up and cofired to obtain a multi-layer ceramic capacitor.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 5 , May 1994 , pp. 1193 - 1198
Copyright
Copyright © Materials Research Society 1994

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References

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