Hostname: page-component-848d4c4894-2pzkn Total loading time: 0 Render date: 2024-06-11T23:56:31.023Z Has data issue: false hasContentIssue false
  • English
  • Français

A System for Electrostatic Reconstructions

Published online by Cambridge University Press:  30 July 2020

Brian Geiser ,
Joe Bunton ,
Isabelle Martin ,
David Reinhard ,
Dan Lenz ,
Ty Prosa  and
David Larson
Brian Geiser
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
Joe Bunton
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
Isabelle Martin
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
David Reinhard
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
Dan Lenz
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
Ty Prosa
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States
David Larson
Affiliation:
CAMECA Instruments Inc., Madison, Wisconsin, United States

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Collaborative Analysis Using Atom Probe Tomography Including TEM/APT Characterization of Metal Alloys and Other Material Systems
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 2622 - 2623
Check for updates
Copyright
Copyright © Microscopy Society of America 2020

References

Bas, P. et al. , Applied Surface Science 87/88 (1995) p. 298–304.10.1016/0169-4332(94)00561-3CrossRefGoogle Scholar
Miller, M. and Hetherington, M., Surface Science 246 (1991) p. 442–449.Google Scholar
Placko, D. and Kundu, T., eds. DPSM for Modeling Engineering Problems. John Wiley & Sons, (2007).10.1002/9780470142400CrossRefGoogle Scholar
Geiser, B. et al. , Microscopy and Microanalysis 15 (2009) p. 302–303.10.1017/S1431927609098298CrossRefGoogle Scholar
Rolland, N. et al. , Microscopy and Microanalysis. 21, (6) (2015) p. 1649–1656.10.1017/S1431927615015184CrossRefGoogle Scholar
Oberdorfer, C. et al. , Ultramicroscopy 159 (2015) p. 184–94.10.1016/j.ultramic.2015.02.008CrossRefGoogle Scholar
Fletcher, C. et al. , J. Phys. D: Appl. Phys. 52 (2019) p. 435305.10.1088/1361-6463/ab3703CrossRefGoogle Scholar
Hatzoglou, C. and Vurpillot, F., Microscopy and Microanalysis 25 (2019) p. 286–287.10.1017/S1431927619002162CrossRefGoogle Scholar
Fleischmann, C. et al. , Ultramicroscopy 194 (2018) p. 221–226.10.1016/j.ultramic.2018.08.010CrossRefGoogle Scholar
Op de Beeck, J. et al. , J. Phys. Chem. C (2019) doi:10.1021/acs.jpcc.9b10194.Google Scholar