Hostname: page-component-848d4c4894-ttngx Total loading time: 0 Render date: 2024-06-08T12:25:57.638Z Has data issue: false hasContentIssue false

Characterization and Comparison of 4H-SiC(1120) and 4H-SiC(0001) 8° Off-Axis Substrates and Homoepitaxial Films

Published online by Cambridge University Press:  15 March 2011

S.M. Bishop
Affiliation:
Materials Research Center, North Carolina State University, Raleigh, NC 27695, USA
E.A. Preble
Affiliation:
Materials Research Center, North Carolina State University, Raleigh, NC 27695, USA
C. Hallin
Affiliation:
Dept. of Phys. and Meas. Tech., Linköping University, SE-531 83, Linköping, Sweden
A. Henry
Affiliation:
Dept. of Phys. and Meas. Tech., Linköping University, SE-531 83, Linköping, Sweden
W. Sarney
Affiliation:
Army Research Lab – SEDD, AMSRL-SE-EI, Adelphi, MD 20783, USA
H.-R. Chang
Affiliation:
Rockwell Scientific Company, Power Electronics Department, Thousand Oaks, CA 91360, USA
L. Storasta
Affiliation:
Dept. of Phys. and Meas. Tech., Linköping University, SE-531 83, Linköping, Sweden
H. Jacobson
Affiliation:
Dept. of Phys. and Meas. Tech., Linköping University, SE-531 83, Linköping, Sweden
Z.J. Reitmeier
Affiliation:
Materials Research Center, North Carolina State University, Raleigh, NC 27695, USA
B.P. Wagner
Affiliation:
Materials Research Center, North Carolina State University, Raleigh, NC 27695, USA
E. Janzén
Affiliation:
Dept. of Phys. and Meas. Tech., Linköping University, SE-531 83, Linköping, Sweden
R.F. Davis
Affiliation:
Materials Research Center, North Carolina State University, Raleigh, NC 27695, USA
Get access

Abstract

Homoepitaxial films of 4H-SiC(1120) and 8° off-axis 4H-SiC(0001) have been grown and characterized. The number of domains and the range of full-width half-maxima values of the x-ray rocking curves of the [1120]-oriented wafers were smaller than the analogous values acquired from the (0001) materials. Hydrogen etching of the former surface for 5 and 30 minutes reduced the RMS roughness from 0.52 nm to 0.48 nm and to 0.28 nm, respectively; the RMS roughness for a 30 μm (1120) film was 0.52 nm. Micropipes in the substrates did not thread beyond the film-substrate interface. The separation distance between stacking faults was determined to be 10 μm by transmission electron microscopy. Hall mobilities and carrier concentrations of 12,200 cm2/Vs and 3.1×1014 cm−3 and 800 cm2/Vs and 7.4×1014 cm−3 were measured at 100°K and 300°K, respectively. Photoluminescence indicated high purity. 4H-SiC(1120) PiN devices exhibited average blocking voltages to 1344 V and a minimum average forward voltage drop of 3.94 V.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Takahashi, J. and Ohtani, N., Phys. Stat. Sol. (b) 202, 163 (1997).Google Scholar
2. Kimoto, T., Yamamoto, T., Chen, Z.Y., Yano, H., and Matsunami, H., Mat. Sci. Forum 338–342, 189 (2000).Google Scholar
3. Yano, H., Hirao, T., Kimoto, T., Matsunami, H., Asano, K., and Sugawara, Y., IEEE Electron Device Lett. 20 (12), 611 (1999).Google Scholar
4. Sumakeris, J.J., Das, M., Hobgood, H.M., Müller, S.G., Paisley, M.J., Ha, S., Skowronski, M., Palmour, J.W. and Carter, C.H. Jr., manuscript from International Conference on Silicon Carbide and Related Materials, Lyon, France, 2003 (not yet published).Google Scholar
5. Roskowski, A.M., Preble, E.A., Einfeldt, S., Miraglia, P.Q., and Davis, R.F., J. Elect. Mat. 31, 421 (2002).Google Scholar
6. Ivanov, I.G., Hallin, C., Henry, A., Kordina, O., and Janzen, E., J. Appyl. Phys 80 (6), 3504, 1996.Google Scholar
7. Rutsch, G., Devaty, R.P., Choyke, W.J., Langer, D.W., Rowland, L.B., Neimann, E., and Wischmeyer, F., Mater. Sci. Forum 338–342, 733 (2000).Google Scholar
8. Iwata, H. and Itoh, K.M., Mater. Sci. Forum 338–342, 729 (2000).Google Scholar
9. Kimoto, T., Itoh, A., Akita, H., Urushidani, T., Jang, S., and Matsunami, H.: Compound-Semiconductors-1994.-Proceedings-of-the-Twenty-First-International-Symposium, 437 (1995).Google Scholar
10. Gotz, W., Schoner, A., Pensl, G., Suttrop, W., Choyke, W.J., Stein, R., and Leibenzeder, S.: J. Appl. Phys. 73, 3332 (1993).Google Scholar