Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-06-02T01:31:39.089Z Has data issue: false hasContentIssue false

Characterization of the CH4/H2/Ar High Density Plasma Etch Process for HgCdTe

Published online by Cambridge University Press:  10 February 2011

C. R. Eddy Jr.
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375, e-mail: eddy@ccfsun.nrl.navy.mil
D. Leonhardt
Affiliation:
NRC Postdoctoral Fellow, U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
V. A. Shamamian
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
R. T. Holm
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
O. J. Glembocki
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
J. R. Meyer
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
C. A. Hoffman
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
J. E. Butler
Affiliation:
U.S. Naval Research Laboratory, 4555 Overlook Ave., SW, Washington, DC 20375
Get access

Abstract

High density plasma etching of Hg1−xCdxTe in CH4/H2/Ar chemistry is examined using mass spectroscopy with careful surface temperature monitoring. The dominant etch products are monitored as a function of surface temperature (15–200°C), ion energy (20–200 eV), total pressure (0.5–5 mTorr), microwave power (200–400 W), and flow fraction of methane in the etch gas mixture (0–30%). In addition, observations are made regarding the regions of parameter space which are best suited to anisotropie, low damage etch processing. These observations are compared with previous results in the form of scanning electron micrographs of etched features for anisotropy evaluation and Hall effect measurements for residual damage. Insights to the overall etch mechanism are given.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Orloff, G.J. and Smith, P.B., J. Vac. Sci. & Technol. A 12, 1252 (1994).Google Scholar
2. Eddy, C.R. Jr, Dobisz, E.A., Hoffman, C.A. and Meyer, J.R., Appl. Phys. Lett. 62, 2362 (1993).Google Scholar
3. Eddy, C.R. Jr, Dobisz, E.A., Meyer, J.R. and Hoffman, C.A., J. Vac. Sci. & Technol. A 11, 1763 (1993).Google Scholar
4. Eddy, C.R. Jr, Hoffman, C.A., Meyer, J.R. and Dobisz, E.A., J. Electronic Mater. 22, 1055 (1993).Google Scholar
5. Eddy, C.R. Jr, Tonucci, R.J., Pearson, D.H., Meyer, J.R. and Hoffman, C.A., “ECR-RIE of HgTe/CdTe and InAs/GaSb Heterostructures Patterned using Nanochannel Glass”, in Narrow Gap Semiconductors, Proceedings of the 7th International Conference on Narrow Gap Semiconductors, Santa Fe, New Mexico, 8–12 January 1995, (Institute of Physics Conference Series Number 144), edited by Reno, J.L. (Institute of Physics Publishing, Philadelphia, PA, 1995), p.364368.Google Scholar
6. Oroff, G.J., Woollam, J.A., He, P., McGuhan, W.A., McNeil, J.R., Jacobson, R.D. and Johns, B., Thin Solid Films 233, 46 (1993).Google Scholar
7. Keller, R.C., Seelmann-Eggebert, M. and Richter, H.J., J. Electronic Mater. 24, 1155 (1995).Google Scholar
8. Pearsall, T.P., Saban, S.R., Booth, J., Beard, B.T. Jr, and Johnson, S.R., Rev. Sci. Instr. 66, 4977 (1995).Google Scholar
9. Aspenes, D.E. in Properties of Gallium Arsenide (2nd edition), EMIS Datareviews Series No. 2, (INSPEC, The Institute of Electrical Engineers, London, England, 1990), p. 153.Google Scholar
10. Eddy, C.R. Jr, Leonhardt, D., Shamamian, V.A., Douglass, S.R., Thorns, B.D. and Butler, J.E., to be published.Google Scholar