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Influence of Nodulizer Type on the Quality of Solder Ball

Published online by Cambridge University Press:  31 January 2011

Xiaoxiao Guo ,
Yanfu Yan ,
Wei Zhang ,
Lifang Feng  and
Miaohui Wang
Xiaoxiao Guo
Affiliation:
guoxiaoxiao03223@163.com, Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang, China
Yanfu Yan
Affiliation:
yanyanfu@mail.haust.edu.cn, Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang, China
Wei Zhang
Affiliation:
zhangwei772@163.com, The First Construction Division CO., LTD. of China Railway Tunnel Group, Chongqing, China
Lifang Feng
Affiliation:
fenglifang198306@126.com, Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang, China
Miaohui Wang
Affiliation:
wangmiaohui0103@yahoo.com.cn, Advanced Manufacture Technology Center, China Academy of Machinery Science & Technology, Beijing, China
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Abstract

A solder ball is the key material of the bump fabrication in the BGA and μBGA high integrated packaging. The nodulizer type is the main factor to affect the quality of the solder ball. In the paper the solder balls are fabricated by the fine wire cutting–remelting method. The influence of different nodulizers on the real sphericity and the surface appearance of the solder balls are investigated. Results show that, the real sphericity of the 63Sn37Pb solder balls is maximum and the surface quality of the solder balls is the best compared with the engine oil, heavy oil and silicon oil when the arachis oil is used as the nodulizer.

Keywords

solderingPbSn
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1158: Symposium F – Packaging, Chip-Package Interactions and Solder Materials Challenges , 2009 , 1158-F05-04
Copyright
Copyright © Materials Research Society 2009

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