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On the Template Mechanism of Enhanced C54-TiSi2 Formation

Published online by Cambridge University Press:  14 March 2011

L. Kappius
Affiliation:
Bell Labs, Lucent Technologies, 600 Mountain Ave. Murray Hill, N.J. 07974
R. T. Tung
Affiliation:
Bell Labs, Lucent Technologies, 600 Mountain Ave. Murray Hill, N.J. 07974rtt@lucent.com
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Abstract

The enhanced formation of the C54-TiSi2 phase by the addition of small amounts of refractory metal (Tm = Mo, Ta, Nb,..) has often been ascribed to a template mechanism from the C40 TixRm1−xSi2 or the (Ti,Rm)5Si3 phase. Due to lattice matching conditions, the presence of either of these phases is thought to lower the interface energies with certain orientations of the C54-TiSi2 grain and, thereby, possibly lower the nucleation barrier of the C54-TiSi2 phase. These proposed template mechanisms are specifically tested in the present work through a study of the nucleation of TiSi2 phase(s) in contact with a pre-existing C40 Ti0.4Mo0.6Si2 or Ti5Si3 layer. No identifiable enhancement in the C54-TiSi2 nucleation was observed which could be attributed to templates. Instead, the nucleation temperature of the C54-TiSi2 phase appeared to be correlated with the grain size of the C49-TiSi2 layer, independent of whether Rm was present. These results are suggestive that the primary mechanism for the enhanced formation of the C54 phase by refractory metals is a reduction in the grain size of the C49 TiSi2phase, likely due to altered kinetics.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Ma, Z., Allen, L.H., and Allman, D.D.J., Thin Solid Films 253, 451 (1994).Google Scholar
2. Mann, R.W., Miles, G.L., Knotts, T.A., Rakowski, D.W., Clevenger, L.A., Harper, J.M.E., D'Heurle, F.M., and Cabral, C. Jr., Appl. Phys. Lett. 67, 3729 (1995).Google Scholar
3. Mouroux, A., Zhang, S.-L., Kaplan, W., Nygren, S., Ostling, M., and Petersson, C.S., Appl. Phys. Lett. 69, 975 (1996).Google Scholar
4. Cabral, C. Jr., Clevenger, L.A., Harper, J.M.E., D'Heurle, F.M., Roy, R.A., Lavoie, C., Saenger, K.L., Miles, G.L., Mann, R.W., and Nakos, J.S., Appl. Phys. Lett. 71, 3531 (1997).Google Scholar
5. Ohmi, S. and Tung, R.T., J. Appl. Phys. 86, 3655 (1999).Google Scholar
6. Quintero, A., Libera, M., Cabral, C. Jr., Lavoie, C., and J.Harper, M.E., J. Mater. Res. 14, 4690 (1999).Google Scholar
7. Bonoli, F., Iannuzzi, M., Miglio, L., and Meregalli, V., Appl. Phys. Lett. 73, 1964 (1998).Google Scholar
8. Tung, R.T., Gibson, J.M., and Poate, J.M., Appl. Phys. Lett. 42, 888 (1983).Google Scholar