Hostname: page-component-848d4c4894-ttngx Total loading time: 0 Render date: 2024-06-02T18:31:07.832Z Has data issue: false hasContentIssue false
  • English
  • Français

SU-8 Processing on a Variety of Substrates

Published online by Cambridge University Press:  10 February 2011

Yuh-Min Chiang ,
Mark Bachman ,
Hung-Pin Chang ,
Charles Chu  and
G. P. Li
Yuh-Min Chiang
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Mark Bachman
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Hung-Pin Chang
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Charles Chu
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
G. P. Li
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Get access

Abstract

SU-8 has become a popular material for micromachining high aspect ratio structures. Typically, SU-8 is spun on a polished silicon wafer for processing. After patterning, the SU-8 is used for micromachined structures directly (such as fluidic channels) or as a mold for electroforming. Non-silicon substrates offer the possibility of cheaper processing, improved mold designs, and multi-material devices. Successful SU-8 processing depends strongly on surface properties of the substrate itself as well as environmental conditions during the processing. We explore the issues involved in transferring SU-8 technology to non-silicon substrates such as glass, plastics and metals. Issues such as wettability, adhesion, and surface tension are explored in this study. The findings indicate the merits of non-spinning approaches, such as dipping, spraying, and brushing and point to new SU-8 processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 91
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lorenz, H., Despont, M., Fahrni, M., LaBianca, N., Vettiger, P., and Renaud, P., “SU-8: a low-cost negative resist for MEMS”, Journal of Micromechanics and Microengineering, 1997 vol.7, p121–124.Google Scholar
2. Despont, M., Lorenz, H., Fahrni, M., Brugger, J., Renaud, P., and Vettiger, P., “High aspect ratio ultrathick, negative-tone near-UV photoresist for MEMS applications", Proceedings of MEMS'97, IEEE, 1997, p518–522.Google Scholar
3. Lee, K., LaBianca, N., Rishton, S., and Zohlgharnain, S., “Micromachining applications for a high resolution ultra-thick photoresist”, Journal of Vaccum Science Technology B, 1995 vol.13, p3012–3016.Google Scholar
4. Eyre, B., Blosiu, J., and , Wilberg, Dtaguchi Optimization for the Processing of Epon SU-8 Resist", “, Proceedings of MEMS'98, IEEE, 1998, 218–222.Google Scholar
5. Wu, S., Polymer Interface and Adhesion, Marcel Dekker, NY (1982), Ch.8.Google Scholar