2 results
Development of Ultra-thin TEM Lamella Preparation Technique and Its Application in Failure Analysis
-
- Journal:
- Microscopy and Microanalysis / Volume 26 / Issue S2 / August 2020
- Published online by Cambridge University Press:
- 30 July 2020, pp. 1400-1402
- Print publication:
- August 2020
-
- Article
-
- You have access
- Export citation
Towards Routine EDX Tomography in Semiconductor Failure Analysis
-
- Journal:
- Microscopy and Microanalysis / Volume 25 / Issue S2 / August 2019
- Published online by Cambridge University Press:
- 05 August 2019, pp. 1820-1821
- Print publication:
- August 2019
-
- Article
-
- You have access
- Export citation