9 results
Solution chemistry effects on cracking and damage evolution during chemical-mechanical planarization
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 10 / October 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1904-1909
- Print publication:
- October 2010
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Mechanical Integrity Study of Air Gap Structures Assisted by FE Simulations
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N02-02
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- 2008
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Fatigue of Damascene Copper Lines under AC Loading
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- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B07-17
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- 2007
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Supercritical Fluid Treatment to Improve Dielectric and Mechanical Properties of Porous ULK Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F02-08
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- 2006
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Cu Resistivity in Narrow lines: Dedicated Experiments for Model Optimization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F09-07
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- 2006
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Morphological and Structural Evolution of an Ultra-low-k Dielectric During the Porogen Removal
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F02-04
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- 2006
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CMP-induced Peeling in Multi-level Ultra Low-k / Cu Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F12-07
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- 2006
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PECVD Versus Spin-on to Perform Porous ULK for Advanced Interconnects: Chemical Composition, Porosity and Mechanical Behavior
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F04-06
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- 2006
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Sol-Gel Derived Silica Layers for Low-k Dielectrics Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D5.26.1
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- 2000
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