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Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint
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- Journal:
- Journal of Materials Research / Volume 29 / Issue 22 / 28 November 2014
- Published online by Cambridge University Press:
- 11 November 2014, pp. 2738-2747
- Print publication:
- 28 November 2014
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- Article
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