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Advanced Metallization Conference 2008 (AMC 2008)

Advanced Metallization Conference 2008 (AMC 2008)

Volume 24

$134.99 (C)

Part of MRS Conference Proceedings

  • Date Published: April 2009
  • availability: In stock
  • format: Hardback
  • isbn: 9781605111254

$134.99 (C)

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About the Authors
  • The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

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    Product details

    • Date Published: April 2009
    • format: Hardback
    • isbn: 9781605111254
    • dimensions: 235 x 158 x 43 mm
    • weight: 1.15kg
    • availability: In stock
  • Editors

    Mehul Naik, Applied Materials Inc., Santa Clara

    Roey Shaviv, Novellus Systems, Inc., San Jose

    Takashi Yoda, Toshiba Corporation, Yokohama

    Kazuyoshi Ueno, Shibaura Injstitute of Technology, Tokyo

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