Skip to content
Register Sign in Wishlist

Electronic Thin-Film Reliability

$79.99

  • Date Published: November 2010
  • availability: Available
  • format: Hardback
  • isbn: 9780521516136

$ 79.99
Hardback

Add to cart Add to wishlist

Other available formats:
eBook


Looking for an evaluation copy?

This title is not currently available for evaluation. However, if you are interested in the title for your course we can consider offering an evaluation copy. To register your interest please contact asiamktg@cambridge.org providing details of the course you are teaching.

Description
Product filter button
Description
Contents
Resources
Courses
About the Authors
  • Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

    • Provides a complete theoretical and practical understanding of electronic thin film reliability
    • Includes real-world examples taken from the author's thirty years experience working within the thin films industry and academia
    • Kept mathematically simple, with step-by-step derivation of important mathematical equations
    Read more

    Customer reviews

    Not yet reviewed

    Be the first to review

    Review was not posted due to profanity

    ×

    , create a review

    (If you're not , sign out)

    Please enter the right captcha value
    Please enter a star rating.
    Your review must be a minimum of 12 words.

    How do you rate this item?

    ×

    Product details

    • Date Published: November 2010
    • format: Hardback
    • isbn: 9780521516136
    • length: 412 pages
    • dimensions: 254 x 180 x 23 mm
    • weight: 0.97kg
    • contains: 186 b/w illus. 23 tables
    • availability: Available
  • Table of Contents

    1. Thin film applications to microelectronic technology
    2. Thin film deposition
    3. Surface energy in thin films
    4. Atomic diffusion in crystalline solids
    5. Applications of diffusion equation
    6. Elastic stress and strain in thin films
    7. Surface kinetic processes on thin films
    8. Interdiffusion and reaction in thin films
    9. Grain boundary diffusion
    10. Irreversible processes in interconnect and packaging technology
    11. Electromigration in metals
    12. Electromigration induced failure in Al and Cu interconnects
    13. Thermomigration
    14. Stress migration in thin films
    15. Reliability science and analysis
    Appendices: A. A brief review of thermodynamic functions
    B. Defect concentration in solids
    C. Step-by-step derivation of Huntington's electron wind force
    D. Elastic constants tables and conversions
    E. Terrace size distribution in Si MBE
    F. Interdiffusion coefficient
    G. Units, tables of conversions, period table.

  • Resources for

    Electronic Thin-Film Reliability

    King-Ning Tu

    General Resources

    Find resources associated with this title

    Type Name Unlocked * Format Size

    Showing of

    Back to top

    *This title has one or more locked files and access is given only to lecturers adopting the textbook for their class. We need to enforce this strictly so that solutions are not made available to students. To gain access to locked resources you either need first to sign in or register for an account.


    These resources are provided free of charge by Cambridge University Press with permission of the author of the corresponding work, but are subject to copyright. You are permitted to view, print and download these resources for your own personal use only, provided any copyright lines on the resources are not removed or altered in any way. Any other use, including but not limited to distribution of the resources in modified form, or via electronic or other media, is strictly prohibited unless you have permission from the author of the corresponding work and provided you give appropriate acknowledgement of the source.

    If you are having problems accessing these resources please email lecturers@cambridge.org

  • Author

    King-Ning Tu, University of California, Los Angeles
    King-Ning Tu is a Professor in the Department of Materials Science and Engineering at the University of California at Los Angeles. Since receiving his Ph.D. in Applied Physics from Harvard University in 1968, he has gained 25 years' experience at IBM T. J. Watson Research Center as a Research Staff Member in the Physical Science Department. He is a Fellow of the American Physical Society, The Metallurgical Society (TMS), and an Overseas Fellow of Churchill College, Cambridge University. Professor Tu has published over 450 journal papers, authored a book (Solder Joint Technology, 2007) and co-authored a textbook (Electronic Thin Film Science, 1992).

Sign In

Please sign in to access your account

Cancel

Not already registered? Create an account now. ×

Sorry, this resource is locked

Please register or sign in to request access. If you are having problems accessing these resources please email lecturers@cambridge.org

Register Sign in
Please note that this file is password protected. You will be asked to input your password on the next screen.

» Proceed

You are now leaving the Cambridge University Press website. Your eBook purchase and download will be completed by our partner www.ebooks.com. Please see the permission section of the www.ebooks.com catalogue page for details of the print & copy limits on our eBooks.

Continue ×

Continue ×

Continue ×

Find content that relates to you

Join us online

This site uses cookies to improve your experience. Read more Close

Are you sure you want to delete your account?

This cannot be undone.

Cancel

Thank you for your feedback which will help us improve our service.

If you requested a response, we will make sure to get back to you shortly.

×
Please fill in the required fields in your feedback submission.
×