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Influence of annealing on oxidation, microstructure and mechanical properties of Ni-49Ti films

Published online by Cambridge University Press:  27 March 2012

S. Bysakh ,
A. Kumar ,
S.V. Kamat ,
S.K. Sharma  and
S. Mohan
S. Bysakh
Affiliation:
CSIR-Central Glass and Ceramic Research Institute, Calcutta 700 032, India
A. Kumar*
Affiliation:
Defence Metallurgical Research Laboratory, DRDO, Hyderabad 500 058, India
S.V. Kamat
Affiliation:
Defence Metallurgical Research Laboratory, DRDO, Hyderabad 500 058, India
S.K. Sharma
Affiliation:
Department of Instrumentation, Indian Institute of Science, Bangalore 560 012, India
S. Mohan
Affiliation:
Department of Instrumentation, Indian Institute of Science, Bangalore 560 012, India
*
a)Address all correspondence to this author. e-mail: atul@dmrl.drdo.in
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Abstract

Thin films of Ni-49 at.%Ti were deposited by DC magnetron sputtering on silicon substrates at 300 °C. The as-deposited amorphous films were annealed at a vacuum of 10−6 mbar at various temperatures between 300 and 650 °C to study the effect of annealing on microstructure and mechanical properties. The as-deposited films showed partial crystallization on annealing at 500 °C. At 500 °C, a distinct oxidation layer, rich in titanium but depleted in Ni, was seen on the film surface. A gradual increase in thickness and number of layers of various oxide stoichiometries as well as growth of triangular shaped reaction zones were seen with increase in annealing temperature up to 650 °C. Nanoindentation studies showed that the film hardness values increase with increase in annealing temperature up to 600 °C and subsequently decrease at 650 °C. The results were explained on the basis of the change in microstructure as a result of oxidation on annealing.

Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 7 , 14 April 2012 , pp. 1068 - 1079
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1.Wayman, C.M.: Thermoelastic martensitic transformations and the nature of the shape memory effect, in Phase Transformations in Solids, edited by Tsakalakos, T. (Mater. Res. Soc. Symp. Proc. 21, North-Holland, Amsterdam, 1984) p. 657.Google Scholar
2.Wolf, R.H. and Heuer, A.H.: TiNi (shape memory) films on silicon for MEMS applications. J. Microelectromech. Syst. 4, 206 (1995).CrossRefGoogle Scholar
3.Fu, Y.Q. and Du, H.J.: Relaxation and recovery of stress during martensite transformation for sputtered shape memory TiNi film. Surf. Coat. Technol. 153, 100 (2002).CrossRefGoogle Scholar
4.Kahn, H., Huff, M.A., and Heuer, A.H.: The TiNi shape-memory alloy and its applications for MEMs. J. Micromech. Microeng. 8, 213 (1998).CrossRefGoogle Scholar
5.Jardine, A.P. and Mercado, P.G.: Dynamics of thin film NiTi cantilevers on Si, in Phase Transformations in Thin Films–Thermodynamics and Kinetics, edited by Atzmon, M., Greer, A.L., Harper, J.M.E., and Libera, M.R. (Mater. Res. Soc. Symp. Proc. 311, Pittsburgh, PA, 1993) p. 161.Google Scholar
6.Seguin, J.-L., Vendan, M., Isalgue, A., Esteve-Cano, V., Carchano, H., and Torra, V.: Low temperature crystallized Ti-rich NiTi shape memory alloy films for microactuators. Sens. Actuators, A 74, 65 (1999).CrossRefGoogle Scholar
7.Yang, Y., Jia, H.S., Zhang, Z.F., Shen, H.M., Hu, A., and Wang, Y.N.: Thin films of NiTi shape memory alloy. Mater. Lett. 22, 137 (1995).CrossRefGoogle Scholar
8.Bush, J.D., Johnson, A.D., Lee, C.H., and Stevenson, D.A.: Shape memory properties in Ni–Ti sputter-deposited films. J. Appl. Phys. 68, 3224 (1990).Google Scholar
9.Huang, X. and Liu, Y.: Effect of annealing on the transformation behavior and superelasticity of NiTi shape memory alloy. Scr. Mater. 45, 153 (2001).CrossRefGoogle Scholar
10.Surbled, P., Clerc, C., Pioufle, B.L., Ataka, M., and Fujita, H.: Effect of the composition and thermal annealing on the transformation temperatures of sputtered TiNi shape memory alloy thin films. Thin Solid Films 401, 52 (2001).CrossRefGoogle Scholar
11.Satoh, G., Birnbaum, A., and Yao, Y.L.: Annealing effect on the shape memory properties of amorphous NiTi thin films. J. Manuf. Sci. Eng. 132, 051004 (2010).CrossRefGoogle Scholar
12.Chu, C.L., Wu, S.K., and Yen, Y.C.: Oxidation behavior of equiatomic TiNi alloy in high temperature air environment. Mater. Sci. Eng., A 216, 193 (1996).CrossRefGoogle Scholar
13.Xu, C.H., Ma, X.Q., Shi, S.Q., and Woo, C.H.: Oxidation behavior of TiNi shape memory alloy at 450–750 °C. Mater. Sci. Eng., A 371, 45 (2004).CrossRefGoogle Scholar
14.Ko, J.H. and Lee, D.B.: High temperature oxidation behavior of TiNi alloys. Mater. Sci. Forum 475–479, 853 (2005).CrossRefGoogle Scholar
15.Wang, X.X., Mao, Z.Y., Cao, Z.W., Qing, R.Y., Jiang, X.C., and Peng, S.Y.: Oxide film and its effect on shape memory effect and biocompatibility in a TiNi alloy, in Proceedings of International Symposium on Shape Memory Materials, Beijing, China, September 25–28, 1994.Google Scholar
16.Miyazaki, S. and Ishida, A.: Martensitic transformation and shape memory behavior in sputtered-deposited TiNi-base thin films. Mater. Sci. Eng., A 273–275, 106 (1999).CrossRefGoogle Scholar
17.Kale, A., Seal, S., Sobczak, N., Morgie, J., and Sundaram, K.B.: Effect of deposition temperature on the morphology, structure, surface chemistry and mechanical properties of magnetron sputtered Ti70–Al30 thin films on steel substrate. Surf. Coat. Technol. 141, 252 (2001).CrossRefGoogle Scholar
18.Huang, X. and Liu, Y.: Some factors affecting the properties of sputter deposited NiTi-base shape memory alloy thin films, in Smart Materials II, edited by Wilson, A.R. and Varadan, V.V., eds.; Proceedings of SPIE Int. Soc. Opt. Eng. Vol. 4934, (2002) p. 210.CrossRefGoogle Scholar
19.Badini, C. and Laurella, F.: Oxidation of FeCrAl alloy: Influence of temperature and atmosphere on scale growth rate and mechanism. Surf. Coat. Technol. 135, 291 (2001).CrossRefGoogle Scholar
20.Chu, J.P., Lai, Y.W., Lin, T.N., and Wang, S.F.: Deposition and characterization of TiNi-base thin films by sputtering. Mater. Sci. Eng., A 277, 11 (2000).CrossRefGoogle Scholar
21.Eswar Raju, K.S.S., Bysakh, S., Sumesh, M.A., Kamat, S.V., and Mohan, S.: The effect of ageing on microstructure and nanoindentation behavior of dc magnetron sputter deposited nickel rich NiTi films. Mater. Sci. Eng., A 476, 267 (2008).CrossRefGoogle Scholar
22.Jarrigea, I., Holligerb, P., Nguyenc, T.P., Ip, J., and Jonnard, P.: From diffusion processes to adherence properties in NiTi microactuators. Microelectron. Eng. 70, 251 (2003).CrossRefGoogle Scholar
23.Fenske, F., Schöpke, A., Schulze, S., and Selle, B.: Analytical studies of nickel silicide formation through a thin Ti layer. Appl. Surf. Sci. 104–105, 218 (1996).CrossRefGoogle Scholar
24.Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
25.Zhang, L., Xie, C., and Wu, J.: Oxidation behavior of sputter-deposited Ti–Ni thin films at elevated temperatures. Mater. Charact. 58, 471 (2007).CrossRefGoogle Scholar
26.Otsuka, K. and Ren, X.: Physical metallurgy of Ti–Ni-based shape memory alloys. Prog. Mater Sci. 50, 511 (2005).CrossRefGoogle Scholar
27.Chan, C.M., Trigwell, S., and Duerig, T.: Oxidation of an NiTi alloy. Surf. Interface Anal. 15, 349 (1990).CrossRefGoogle Scholar
28.Kekare, S.A., Shelton, D.K., and Aswath, P.B.: Oxidation of high-temperature intermetallics, in The Minerals, Metals and Materials Society, (Warrendale, PA, 1993) p. 325.Google Scholar
29.Tall, P.D., Ndiaye, S., Beye, A.C., Zong, Z., Soboyejo, W.O., Lee, H.J., Ramirez, A.G., and Rajan, K.: Nanoindentation of Ni–Ti thin films. Mater. Manuf. Processes 22, 175 (2007).CrossRefGoogle Scholar