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New methods of analyzing indentation experiments on very thin films

Published online by Cambridge University Press:  31 January 2011

Han Li
Affiliation:
School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
Nicholas X. Randall
Affiliation:
CSM Instruments, Needham, Massachusetts 02494
Joost J. Vlassak*
Affiliation:
School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
*
a)Address all correspondence to this author. e-mail: vlassak@esag.harvard.edu
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Abstract

Indentation experiments on thin films are analyzed by using a rigorous solution to model elastic substrate effects. Two cases are discussed: elastic indentations where film and substrate are anisotropic and elastoplastic indentations where significant material pileup occurs. We demonstrate that the elastic modulus of a thin film can be accurately measured in both cases, even if there is significant elastic mismatch between film and substrate.

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Articles
Copyright
Copyright © Materials Research Society 2010

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References

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