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Four Dimensional Scanning Transmission Electron Microscopy during the in situ Annealing of a CuZrAl Bulk Metallic Glass

Published online by Cambridge University Press:  05 August 2019

Thomas C. Pekin*
Affiliation:
Department of Physics, Humboldt-Universität zu Berlin, Newtonstraße 15, 12489 Berlin, Germany. Department of Materials Science & Engineering, University of California, Berkeley, CA 94720, USA. National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA.
Christoph Gammer
Affiliation:
Erich Schmid Institute of Materials Science, Jahnstraße 12, Leoben, Austria, 8700.
Colin Ophus
Affiliation:
National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA.
Robert O. Ritchie
Affiliation:
Department of Materials Science & Engineering, University of California, Berkeley, CA 94720, USA. Materials Sciences Division, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, CA 94720, USA.
Andrew M. Minor
Affiliation:
Department of Materials Science & Engineering, University of California, Berkeley, CA 94720, USA. National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA.
*
*Corresponding author: tcpekin@physik.hu-berlin.de

Abstract

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Type
In situ TEM Characterization of Dynamic Processes During Materials Synthesis and Processing
Copyright
Copyright © Microscopy Society of America 2019 

References

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[11]The authors acknowledge support from the Director, Office of Science, Office of Basic Energy Sciences, Materials Sciences and Engineering Division, of the U.S. Department of Energy under Contract No. DE-AC02-05-CH11231 within the Mechanical Behavior of Materials program. Work at the Molecular Foundry was supported by the Office of Science, Office of Basic Energy Sciences, of the U.S. Department of Energy under Contract No. DE-AC02-05CH11231. T.C.P. acknowledges funding from the DFG project BR 5095/2-1 (“Compressed sensing in ptychography and transmission electron microscopy”).Google Scholar