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Polyallylamine as an Adhesion Promoter for SU-8 Photoresist

  • Shiladitya Chatterjee (a1), George H. Major (a1), Barry M. Lunt (a2), Massoud Kaykhaii (a1) and Matthew R. Linford (a1)...
Abstract
Abstract

Resist lithography is an important microfabrication technique in the electronics industry. In this, patterns are transferred by irradiation onto a photosensitive polymer. SU-8 has emerged as a favorite photoresist for High Aspect Ratio (HAR) lithography, showing high chemical and mechanical stability and biocompatibility. Unfortunately, its poor adhesion to substrates is a drawback, with possible solutions being the use of low-viscosity SU-8, surface modification with a low molecular weight adsorbate like hexamethyldisilazane (HMDS), or a commercial adhesion promotion reagent. However, HMDS and the commercial reagent require surface dehydration and/or curing, and a modified form of SU-8 is not always desirable. Here, we demonstrate the use of a water-soluble, amine-containing polymer, polyallylamine (PAAm), which spontaneously adsorbs to silica surfaces, as a simple, easy-to-apply, and reactive adhesion promoter for SU-8. Conditions for the use of PAAm are explored, and the resulting materials are characterized by X-ray photoelectron spectroscopy (XPS), spectroscopic ellipsometry (SE), and wetting.

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Corresponding author
* Corresponding author. mrlinford@chem.byu.edu
References
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Microscopy and Microanalysis
  • ISSN: 1431-9276
  • EISSN: 1435-8115
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