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3D stretchable electronics achieves ultrahigh conductivity

By Prachi Patel August 7, 2019

MRS Bulletin Materials News Podcast

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Prachi Patel of MRS Bulletin interviews Benjamin C.-K. Tee of the National University of Singapore about an interfacial design for stretchable electronics that uses three-dimensional helical copper micro-interconnects embedded in an elastic rubber substrate. Read the article in APL Materials.