Hostname: page-component-7dd5485656-bvgqh Total loading time: 0 Render date: 2025-10-31T16:43:06.007Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVDW2N Barrier Layer

Published online by Cambridge University Press:  01 February 2011

Degang Cheng ,
Guillermo Nuesca  and
Eric Eisenbraun
Degang Cheng
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
Guillermo Nuesca
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
Eric Eisenbraun
Affiliation:
School of Nano Sciences and Nano Engineering, The University at Albany-SUNY Albany, NY12203, U.S.A.
Get access

Abstract

The effect of different plasma pre-treatments of chemical vapor deposited (CVD) tungsten nitride (W2N) surfaces on the dewetting behavior of subsequently grown CVD Cu films was investigated by annealing the resulting film stacks in high purity argon. It was found that a hydrogen plasma pre-treatment significantly improved the resistance to Cu dewetting from the W2N surfaces while ammonia and nitrogen plasma pretreatment slightly accelerated the dewetting process. The proposed mechanisms and ramifications of these findings were discussed.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Murakami, M., Uekubo, M., Oku, T., Nii, K., Takahiro, K., Yamaguchi, S., Nakano, T., and Ohta, T., Thin Solid Films 286, 170 (1996).Google Scholar
2. Lee, C., Kim, Y., and Lee, J., Appl. Phys. Lett. 64, 619 (1994).Google Scholar
3. Lai, K., Mak, A., Wendling, T., Jian, P., and Hathcock, B., Thin Solid Films 332, 329 (1998)Google Scholar
4. Lu, J., Hsu, W., Luttmer, J., Magel, L., and Tsai, H., J. Electrochem. Soc. 145, L21 (1998).Google Scholar
5. Marcus, S. and Foster, R. R., Thin Solid Films 236, 330 (1993).Google Scholar
6. Kelsey, J. E., Goldberg, C., Nuesca, G., Peterson, G., and Kaloyeros, A. E., J. Vac. Sci. Technol. B 17, 1101 (1999).Google Scholar
7. Ekstrom, B. M., Lee, S., Magtoto, N., and Kelber, J. A., Appl. Surface Sci. 171, 275 (2001).Google Scholar
8. Ozaki, A. and Aika, K. I., A Treatise on Dinitrogen Fixation, Edited by Hardy, R.W. F., Bottomley, F., and Burns, R. C., Chapter 4, Wiley, New York (1979).Google Scholar
9. Shamir, N., Lin, J. C., and Gomer, R., Surface Sci. 214, 74 (1989).Google Scholar