Skip to main content
×
×
Home

Application Of Electroless Copper Plating Technology For Thin Film Laminated Multilayer Wiring Board

  • T. Itabashi (a1), H. Akahoshi (a1), A. Takahashi (a1), M. Suzuki (a1) and M. Maeda (a2)...
Abstract
Abstract

A thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.

Copyright
References
Hide All
1 Wilcox D. L., Solid-State Tech. 1971, 40.
2 Jansen R. J., Cummings J. P., and Vora H., in Proc. 34th Electronic Components Conf., 73 (1984).
3 Inoue T., Matsuyama H., Matsuzaki E., Narizuka Y., and Ishino M., in Proc. 42nd Electronic Components and Technology Conf., 704 (1992).
4 Pan J. T., Poon S. and Nelson B., in Proc. 8th IEPS, 174 (1988).
5 Miura O., Miyazaki K., Takahashi A., Watanabe R. and Miwa T., IEEE Trans. Comp. Hybrids, Manufact. Technol., 16, 817 (1993).
6 Hammond J., Circuit World, 20 (1), 7 (1993).
7 Itabashi T., Suzuki M., Watanabe R., Okoshi Y., Suzuki H., Akahoshi H. and Takahashi A., in Proc. 1995 Japan TEMT Symposium, pp. 318322.
8 Takahashi A., Itabashi T., Watanabe R., Miwa T., Akahoshi H., in Proc. Printed Circuit World Convention VII, 13 (1996).
9 Akahoshi H., Kawamoto M., Itabashi T., Miura O., Takahashi A., Kobayashi S., Miyazaki M., Mutoh T., Wajima M. and Ishimaru T., IEEE Trans. Comp. Hybrids, Manufact. Technol., 18, 127(1995).
10Takahashi T., Itabashi T. and Akahoshi H., in Proc. 90th Meeting of Surface Finishing Society Japan, 170(1994).
11 Jacobs Jan W. M. and Rikken Jan M. G., J. of Electrochem. Soc, 135 (11), 2822 (1988).
Recommend this journal

Email your librarian or administrator to recommend adding this journal to your organisation's collection.

MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
  • URL: /core/journals/mrs-online-proceedings-library-archive
Please enter your name
Please enter a valid email address
Who would you like to send this to? *
×