A thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.
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