Hostname: page-component-8448b6f56d-sxzjt Total loading time: 0 Render date: 2024-04-18T01:18:57.021Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of the early stages of EM in Al-based metal lines by means of a HRRMT based on an extremely stable ambient temperature

Published online by Cambridge University Press:  15 February 2011

V. D'Haeger ,
W. De Ceuninck ,
L. De Schepper  and
L. M. Stals
V. D'Haeger
Affiliation:
Limburgs Universitair Centrum - Institute for Materials Research - Materials Physics Division - Universitaire Campus - Wetenschapspark I - B-3590 Diepenbeek (Belgium).
W. De Ceuninck
Affiliation:
Limburgs Universitair Centrum - Institute for Materials Research - Materials Physics Division - Universitaire Campus - Wetenschapspark I - B-3590 Diepenbeek (Belgium).
L. De Schepper
Affiliation:
Limburgs Universitair Centrum - Institute for Materials Research - Materials Physics Division - Universitaire Campus - Wetenschapspark I - B-3590 Diepenbeek (Belgium).
L. M. Stals
Affiliation:
Limburgs Universitair Centrum - Institute for Materials Research - Materials Physics Division - Universitaire Campus - Wetenschapspark I - B-3590 Diepenbeek (Belgium).
Get access

Abstract

A high resolution resistometric measurement technique (HRRMT) is used to study electromigration (EM) in different Al-based metal lines. Instead of using a bridge-method, the high resolution is now obtained by performing experiments in a very stable temperature environment. The main advantage of this technique is that resistance variations are measured, due to processes that occur in the tested metal line only. During EM, both resistivity and geometrical variations can occur, both resulting in a resistance change. A new method is proposed in order to separate these two contributions on-line during the whole EM-experiment. It is shown that even at low current stress, geometrical changes are the main cause for the EM-induced resistance increase.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 133
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lloyd, J.R., Quick tests for electromigration : useful but not without danger, MRS Symp. Proc., Vol. 265, p.177–187, 1992.Google Scholar
2. Scorzoni, A., Munari, I.De and Stulens, H., Non-destructive electrical techniques as means for understanding the basic mechanisms of electromigration, MRS Symp. Proc., Vol. 337, p.515–526, 1994.Google Scholar
3. De Schepper, L., Stals, L.M. and Roggen, J., A new approach to reliability of electronic material systems, ESA Electron.Comp.Conf. ESTEC, 1990.Google Scholar
4. Sanchez, J.E. and Pham, V., Interpretation of resistance changes during interconnect reliability testing, MRS Symp. Proc., Vol. 338, p.459–470, 1994.Google Scholar
5. Niehoff, J., Electromigration early resistance change modeling, PhD-thesis, Univ.Twente, 1994.Google Scholar
6. Scorzoni, A., De Munari, I., Stulens, H. and D'Haeger, V., Non-linear resistance behavior in the early stages and after electromigration in Al-Si-lines, MRS Symp. Proc., Vol. 391, p.513–519, 1995.Google Scholar
7. In preparation for submission.Google Scholar
8. Shatzkes, M. and Lloyd, J.R., A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2, J.Appl.Phys., Vol.59 no. 11, 1986.Google Scholar
9. Korhonen, M.A., Borgesen, P., Li, Tu. C., Stress evolution due to electromigration in confined metal lines, J.Appl.Phys., Vol. 73 no.8, p.3790, 1993.Google Scholar
10. D'Haeger, V., Stulens, H., Ceuninck, W.De, Schepper, L.De, Tielemans, L., Gallopyn, G., Pauw, P.De and Stals, L.M., The use of early resistance and early TCR changes to predict the reliability of on-chip interconnects, QRE Int., p. 309–314, 1994.Google Scholar
11. Stulens, H., Het bepalen van activatie-energiespectra voor structuurrelaxatie van thermisch niet-stabiele systemen, PhD-thesis, Diepenbeek (B), 1994.Google Scholar
12. Cook, B.C., Nuclear Instruments and methods, Vol. 24, p.256, 1963.Google Scholar