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Deposition of Piezoelectric ZnO Films by RF Magnetron Sputtering and its Application to SAW Devices

Published online by Cambridge University Press:  01 February 2011

Seol Hee Choi
Affiliation:
snowgirl-choi@hanmail.net, Korea Polytechnic University, Department of Advanced Materials Engineering, 2121 Jungwang-Dong, Shihung-Si, Kyonggi-Do, 429-793, Korea, Republic of
Chan Hyoung Kang
Affiliation:
snowgirl-choi@hanmail.net, Korea Polytechnic University, Department of Advanced Materials Engineering, 2121 Jungwang-Dong, Shihung-Si, Kyonggi-Do, 429-793, Korea, Republic of
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Abstract

Highly c-axis oriented, dense, and fine-grained polycrystalline ZnO films with smooth surface and high resistivity were deposited on 4 inch silicon wafers by employing ZnO targets in a radio-frequency (RF) magnetron sputtering system. By changing applied RF power, substrate temperature and O2/Ar gas ratio, the optimum process parameters were found to be 150 W, 200 °C and 30/70, respectively. Applying the ZnO films deposited under these optimum conditions, surface acoustic wave (SAW) devices of ZnO/IDT/SiO2/Si structure were fabricated by conventional photolithography and etching processes. The interdigital transducers (IDT), made of the aluminum deposited by DC magnetron sputter, were patterned as 2.5/2.5 μm of finger width/spacing. Another type of SAW filter of IDT/ZnO/diamond/Si structure was fabricated. In this structure, high-quality nanocrystalline diamond (NCD) films were deposited on 4 inch silicon wafers by direct current (DC) plasma assisted chemical vapor deposition method using H2-CH4 mixture as precursor gas. On the top of the diamond films, ZnO films were deposited under the optimum conditions. The aluminum IDT pattern was fabricated on the ZnO/diamond layered films. The characteristics of the fabricated SAW devices were evaluated in terms of center frequency, insertion loss, and wave propagation velocity.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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