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DNA-Templated Assembly of Conducting Gold Nanowires

Published online by Cambridge University Press:  01 February 2011

Amro Satti
Affiliation:
amro.satti@ucd.ie, University College Dublin, School of Chemistry and Chemical Biology, Belfield, Dublin, N/A, D4, Ireland, +353 1 716 2107, +353 1 716 1178
Damian Aherne
Affiliation:
damian.aherne@ucd.ie, University College Dublin, School of Chemistry and Chemical Biology, Belfield, Dublin, N/A, D4, Ireland
Claire Barrett
Affiliation:
claire.barrett@tyndall.ie, Tyndall National Institute, Nanotechnology Group, Lee Maltings, Cork, N/A, N/A, Ireland
Liam Floyd
Affiliation:
liam.floyd@tyndall.ie, Tyndall National Institute, Nanotechnology Group, Lee Maltings, Cork, N/A, N/A, Ireland
Aidan Quinn
Affiliation:
aidan.quinn@tyndall.ie, Tyndall National Institute, Nanotechnology Group, Lee Maltings, Cork, N/A, N/A, Ireland
Gareth Redmond
Affiliation:
gareth.redmond@tyndall.ie, Tyndall National Institute, Nanotechnology Group, Lee Maltings, Cork, N/A, N/A, Ireland
Donald Fitzmaurice
Affiliation:
donald.fitzmaurice@ucd.ie, University College Dublin, School of Chemistry and Chemical Biology, Belfield, Dublin, N/A, D4, Ireland
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Abstract

The use of DNA to template the assembly of gold nanowires from gold nanoparticles is reported. Double-stranded calf thymus DNA, was deposited on a polystyrene-coated silicon wafer substrate. The substrate was then exposed to an aqueous dispersion of positively charged gold nanoparticles (~ 4 nm diameter), which adsorbed at the negatively charged DNA template. The adsorbed nanoparticles were then enlarged and enjoined by electroless deposition leading to formation of continuous nanowires of 85 nm average diameter. Gold electrodes were then overlaid on individual nanowires using conventional lithographic techniques. Two-terminal current-voltage measurements were employed to characterize the electrical characteristics of single nanowires. The nanowires exhibit resistivity values < 6 × 10-7 Ωm. These and related findings have implications for the design and assembly of next generation electronic devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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