Hostname: page-component-8448b6f56d-jr42d Total loading time: 0 Render date: 2024-04-19T03:24:24.213Z Has data issue: false hasContentIssue false

Effect of Glow Discharge Current on Composition of Y‐Ba‐Cu‐0 Films by High Pressure Dc Sputtering Process

Published online by Cambridge University Press:  28 February 2011

R.J. Lin
Affiliation:
Materials Research Laboratories, Industrial Technology Research Institute, 195 Chung‐hsing Rd., Sec. 4, Chutung, Hsinchu 31015, Taiwan, R.O.C.
Y.C. Chen
Affiliation:
Materials Research Laboratories, Industrial Technology Research Institute, 195 Chung‐hsing Rd., Sec. 4, Chutung, Hsinchu 31015, Taiwan, R.O.C.
P.T. Wu
Affiliation:
Materials Research Laboratories, Industrial Technology Research Institute, 195 Chung‐hsing Rd., Sec. 4, Chutung, Hsinchu 31015, Taiwan, R.O.C.
Get access

Abstract

The Y‐Ba‐Cu‐0 (YBCO) films were grown on (100)Mg0 substrate by the high pressure DC diode sputtering process. The targets were YBCO compounds made by solid‐state reaction. The sputtering gas was Ar‐50%02, and total pressure was 1.5 torr. As‐deposited superconducting YBCO films can be prepared at low substrate temperature at high discharge current. For Y1Ba2Cu30x target, the atomic ratio Ba/Y in the films almost remains constant (Ba/Y = 1.7) and Cu content monotonically increases with increasing discharge current. The Cu content in the film approaches to that of the target at low discharge current. Concentrations of 0 and 02+ in plasma markedly increase during increase of discharge current. High Cu content at large discharge current may be caused by action of electrical field on Ba+ and Y+.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Lee, W.Y., Salem, J., Lee, V., Hung, T., Savoy, R., Deline, V. and Puran, J., Appl. Phys. Lett. 52, 2263(1988).Google Scholar
2 Li, H.C., Linker, G., Ratzel, F., Smithey, R. and Geerk, J., Appl. Phys. Lett. 52, 1098(1988).Google Scholar
3 Wehner, G.K., Kim, Y.H., Kim, D.H. and Goldman, A.M., Appl. Phys. Lett. 52, 1187(1988).Google Scholar
4 Terada, N., Ihara, H., Jo, M., Hirabayashi, M., Kimura, Y., Matsutani, K., Hirata, K., Ohno, E., Sugise, R. and Kawashima, F., Jpn. J. Appl. Phys. 21, L639(1988).Google Scholar
5 Hoshi, Y. and Naoe, M., IEEE Trans Mag. 25, 3518(1989).Google Scholar
6 Olsen, R.R., King, M.E. and Wehner, G.K., J. Appl. Phys. 50, 3677 (1979).Google Scholar
7 Lin, R.J. and Wu, P.T., in Science and Technology of Thin Film Superconductors, edited by McConnell, Robert D. and Wolf, Stuart A. (Plenum Press, New York, 1989) pp.157164.Google Scholar
8 Lin, R.O. and Wu, P.T., Jpn. J. Appl. Phys. 28, No12(1989).Google Scholar
9 Ying, Q.Y., Shaw, D.T. and Kwok, H.S., Appl. Phys. Lett. 53, 1762(1988).Google Scholar
10 Fleddermann, C.B., J. Appl. Phys. 65, 2861(1989).Google Scholar
11 Weimer, Wayne A., Appl. Phys. Lett. 52, 2171(1988).Google Scholar