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Effect of thermal cycling on performance of Poly(3-hexylthiophene) Transistors

Published online by Cambridge University Press:  15 February 2011

Brian A. Mattis
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley Berkeley, CA 94720, U.S.A.
Paul C. Chang
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley Berkeley, CA 94720, U.S.A.
Vivek Subramanian
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley Berkeley, CA 94720, U.S.A.
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Abstract

We present the results of studies on the electrical and physical modifications to Poly(3-hexylthiophene), upon thermal annealing. Thermally-induced performance modifications and thermal stability of polythiophene thin film transistors are explored. We observe substantial mobility improvements in devices annealed at low temperatures (>80°C), as well as increases in on/off ratios by two orders of magnitude at moderate anneal temperatures (~120°C). We document changes in conductivity, mobility, on current, and on/off ratio with anneal temperature and total thermal budget. In conjunction with material analysis, we develop qualitative models for the mechanisms involved in the annealing/degradation processes. Hence, this study provides a comprehensive analysis of the effect of thermal cycling of polythiophene TFTs on various device performance metrics, and identifies the relevant thermal limits and failure mechanisms.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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