Hostname: page-component-8448b6f56d-sxzjt Total loading time: 0 Render date: 2024-04-20T00:39:51.363Z Has data issue: false hasContentIssue false

Epitaxial Growth of Sil-xGex/Si Heterostructures by Limited Reaction Processing for Minority Carrier Device Applications

Published online by Cambridge University Press:  25 February 2011

C. A. King
Affiliation:
Stanford Electronics Laboratories, Stanford, CA 94305
J. L. Hoyt
Affiliation:
Stanford Electronics Laboratories, Stanford, CA 94305
D. B. Noble
Affiliation:
Stanford Electronics Laboratories, Stanford, CA 94305
C. M. Gronet
Affiliation:
Stanford Electronics Laboratories, Stanford, CA 94305
J. F. Gibbons
Affiliation:
Stanford Electronics Laboratories, Stanford, CA 94305
M. P. Scott
Affiliation:
Hewlett-Packard Company, Palo Alto, CA 94306
S. S. Laderman
Affiliation:
Hewlett-Packard Company, Palo Alto, CA 94306
T. I. Kamins
Affiliation:
Hewlett-Packard Company, Palo Alto, CA 94306
J. Turner
Affiliation:
Hewlett-Packard Company, Palo Alto, CA 94306
Get access

Abstract

In an effort to extend the performance limits of semiconductors, devices based on heterojunctions rather than homojunctions are being investigated with great interest. Heterojunctions allow certain device design constraints to be relaxed because the charge distribution, electric field, and potential can be tailored extensively, permitting better device structures to be utilized. Silicon technology today enjoys a firm grip on a large portion of the electronics industry due in part to its superior material properties.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] People, R., Phys. Rev. B, vol. 32, no. 2, pp. 14051408, 1985.CrossRefGoogle Scholar
[2] Lang, D. V., People, R., Bean, J. C., and Sergent, A. M., Appl. Phys. Lett., vol. 47, no. 12, pp. 13331335, 1985.CrossRefGoogle Scholar
[3] Gibbons, J. F., Gronet, C. M., and Williams, K. E., Appl. Phys. Let., vol. 47, no. pp. 721723, 1985.CrossRefGoogle Scholar
[4] Gronet, C. M., Ph. D. Thesis, Stanford University, Oct.1988.Google Scholar
[5] King, C. A., Gronet, C. M., Gibbons, J. F., and Wilson, S. D., IEEE Electron Device Lett., vol. 9, no. 5, pp. 229231, 1988.CrossRefGoogle Scholar
[6] Bean, J. C., Sheng, T. T., Feldman, L. C., Fiory, A. T., and Lynch, R. T., Appl. Phys. Lett., vol. 44, no. 1, pp. 102104, 1983.CrossRefGoogle Scholar
[7] King, C. A., Hoyt, J. L., Noble, D. B., Gibbons, J. F., Scott, M. P., Laderman, S. S., and Kamins, T. I., IEEE Electron Device Lett., vol. 10, no. 4, pp. 159161, 1989.CrossRefGoogle Scholar
[8] Matare, H. F., Defect Electronics in Semiconductors (Wiley-Interscience, New York, 1971).Google Scholar
[9] Yagi, H., Tsuyuki, T., Koma, K., and Miyazawa, Y., “A novel bipolar device with low emitter impurity concentration structure,” in IEDM Tech. Dig. 1974), pp. 262265.Google Scholar
[10] Kroemer, H., Proc. IEEE, vol. 70, no. 1, pp. 1325, 1982.CrossRefGoogle Scholar
[11] Scott, M. P., Laderman, S. S., Kamins, T. I., Rosner, S. J., Nauka, K., Noble, D. B., Hoyt, J. L., King, C. A., Gronet, C. M., and Gibbons, I. F., in Thin Films: Stresses and Mechanical Properties, edited by Nix, W. D., Bravman, I. C., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Proc., Pittsburgh, PA 1989).Google Scholar
[12] Hull, R., Bean, J. C., Cerdeira, F., Fiory, A. T., and Gibson, J. M., Appi. Phys. Lett., vol. 48, no. 1, pp. 5658, 1986.CrossRefGoogle Scholar
[13] Ashizawa, Y., Akbar, S., Schaff, W. J., Eastman, L. F., Fitzgerald, E. A., and Ast, D. G., J. Appl. Phys., vol. 64, no. 8, pp. 40654074, 1988.CrossRefGoogle Scholar
[14] People, R., Bean, J. C., and Lang, D. V., “Substrate orientation effects on band alignments for pseudomorphic (Ge,Si) alloys on silicon,” in Proceedings 18th International Conference on the Physics of Semiconductors, Stockholm, Sweden (World Scientific Publishers, Singapore, 1987), pp. 767770.Google Scholar
[15] Braunstein, R., Moore, A. R., and Herman, F., Phys. Rev., vol. 109, no. 3, pp. 695710, 1958.CrossRefGoogle Scholar
[16] King, C. A., Hoyt, J. L., Gronet, C. M., Gibbons, J. F., Scott, M. P., Rosner, S. J., Reid, G., Laderman, S. S., Nauka, K., and Kamins, T. I., IEEE Trans. Electron Devices, vol. 35, no. 12, pp. 2454, 1988.CrossRefGoogle Scholar