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Fabrication of Thermoelectric Modules Using Thermoelectric Pastes and an Additive Technology

Published online by Cambridge University Press:  10 February 2011

Xiaomei Xi ,
Goran Matijasevic ,
Linh Ha  and
Dan Baxter
Xiaomei Xi
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Goran Matijasevic
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Linh Ha
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
Dan Baxter
Affiliation:
Ormet Corporation, 2236 Rutherford Rd., Carlsbad, CA 92008
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Abstract

Polymer based thermoelectric pastes have been developed by dispersing metal and metal alloy powders into a polymer binder system. Thermoelectric materials and elements are formed by depositing the pastes into a mold or onto a substrate and subsequently sintering them to form a conductive network with thermoelectric properties. A Seebeck coefficient of 65 μV/°K, and a resistivity of 0.05 Ω-cm have been achieved in the early stage of material development. A novel processing method has also been developed for the fabrication of small size thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples using these pastes. Thermoelectric elements as small as 250 μm in diameter and 25 μm in thickness have been achieved. Thermoelectric modules with 275 couples/in2have been fabricated using the thermoelectric pastes and the fabrication technique. Further improvement in the material properties and reduction in the sizes of the thermoelectric elements are underway.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 545: Symposium Z – Thermoelectric Materials 1998 - The Next Generation… , 1998 , 143
Copyright
Copyright © Materials Research Society 1999

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