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Grain Size Effects on the Adhesion of Thin Ductile Films

Published online by Cambridge University Press:  10 February 2011

M.J. Cordill
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
T. Muppidi
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA
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Abstract

Grain size can be controlled by varying the process conditions used to deposit the film and post growth processing. This study examines how the grain size will impact the mechanical properties, hardness and adhesion, of thin ductile films on brittle substrates. The grain structures of copper and tin films were examined using OIM and AFM. The interfacial fracture toughness of each film was calculated using a tungsten overlayer and mechanics based models. The hardnesses of the films were correlated to the measured interfacial fracture toughness, and demonstrate that increased hardness correlates to an increased sensitivity to the Mode II component of loading.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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