Hostname: page-component-8448b6f56d-m8qmq Total loading time: 0 Render date: 2024-04-23T16:52:00.235Z Has data issue: false hasContentIssue false
  • English
  • Français

Hard Quasiamorphous Carbon - A Prospective Construction Material for Micro-Electro-Mechanical Systems

Published online by Cambridge University Press:  15 February 2011

Benjamin F. Dorfman ,
P. Asoka-Kumar ,
Fred H. Pollak ,
J. Z. Wan  and
Qing Zhu
Benjamin F. Dorfman
Affiliation:
Atomic-Scale Design, Inc., P.O. Box 152, Stony Brook, N.Y., 11790.BDorfman@aol.com
P. Asoka-Kumar
Affiliation:
Brookhaven National Laboratory, Physics Department, Upton, N.Y., 11973
Fred H. Pollak
Affiliation:
Phys. Dep. and NY State Center for Adv.Techn. in Ultrafast Photonic Materials and Applications, Brooklyn College of CUNY, Brooklyn, NY 11210
J. Z. Wan
Affiliation:
Phys. Dep. and NY State Center for Adv.Techn. in Ultrafast Photonic Materials and Applications, Brooklyn College of CUNY, Brooklyn, NY 11210
Qing Zhu
Affiliation:
Brookhaven National Laboratory, Physics Department, Upton, N.Y., 11973
Get access

Abstract

A new form of sp3/sp2 carbon has been fabricated which exhibits a large number of valuable properties. This material combines low density (≤1.65 g/cm3), low stress (≤0,05 GPa), low thermal expansion (1.6×10−6 K−1) with high hardness (˜ 30 GPa), modulus (˜ 200 GPa), cracking threshold (≥ 3 N), fracture toughness (≥ 10 MPa-m1/2), long-term thermal stability (≥ 450°C in air and ≥ 600°C without oxygen), extremely high thermal shock resistance, excellent interface and adhesion to silicon, metals, and ceramics and an absolute resistance to the silicon etching acids. Most of its properties are actually constant up to 700K. The material combines a basically amorphous structure with one-axis anisotropy and a graphite-like layered arrangement with a length scale of the modulation about 14Å. We refer to this quasi-amorphous material as QUASAM. This paper describes QUASAM synthesis conditions, growth front planarity and material characterization with high-resolution x-ray diffraction, positron annihilation spectroscopy, atomic force microscopy and micro-Raman spectroscopy. In addition the mechanical and thermal examination of QUASAM and QUASAM/Si will be presnted in terms of micro-electro-mechanical systems (MEMS) and the technology prospective requirements of MEMS.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 444: Symposium I – Materials for Mechanical and Optical Microsystems , 1996 , 15
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Koester, D.A., Markus, K.W., Walters, M.D., Computer, 29, 1, p. 93–4 1996 Google Scholar
2. Dorflnan-Pryrodnii, V.F., Evolution of Microelectronics Technology and Micromechanics, Radioelectronica I Sviaz, Znanie, Moscow, 1985 (in Russian).Google Scholar
3. Dorfman, V.F., Synthesis of Solid-State Structures, Moscow, Metallurgia, 1986 (in Russian).Google Scholar
4. Dorfman, V.F., Komarova, T.E., Petrushinina, C.A., Pypkin, B.N., Khan, I.D., Plasma and Ionstimulated Polymerization In The Modem Devices, Moscow, Pribory I Systemy Upravlenia, TzNIITEI Priborostroenia, 1984 (in Russian).Google Scholar
5. Kahn, H., Stemmer, S., Nandakumar, K., Heuer, A.H., Mullen, R.L., Ballarini, , Huff, M.A., Proceedings. IEEE, The Ninth Ann. Int. Workshop on Micro Electro Mechanical Syst., p. 343–8Google Scholar
6. Saif, M.T.A., McDonald, N.C., Journal of Microelectromechanical Systems, 5, 2, p.79–97(1996)Google Scholar
7. Shaw, K.A., McDonald, N.C., Proceedings. IEEE, The Ninth Annual International Workshop on Micro Electro Mechanical Systems, p.44–8. 1996 Google Scholar
8. Dorfman, Benjamin. F., USA Patent pending, 1996 Google Scholar
9. Dorfman, V. F., Diamond-Like Nanocomposites (DLN), Thin Sol.Films, 212 (1992) 267–273 Google Scholar
10. Asoka-Kumar, P., Dorfman, B. F., Abraizov, M.G., Yan, D. and Pollak, Fred H., J.Vac. Sci. Technol. A 13(3), 1995 Google Scholar
11. Asoka-Kumar, P., Atalo, M., Ghosh, V.J., Kruseman, A.C., Nielsen, N., and Lynn, K.G., Phys. Rev. Lett., 77, p. 2097 (1996).Google Scholar
12. CRC Handbook of Chemistry and Physics, Lide, David R. Editor-in-Chief, 75th edition, CRC Press, Inc., Boca Raton, Fl., 1995, p. 12–87.Google Scholar
13. Ruckman, M., unpublished.Google Scholar
14. Lim, P.K., Gaspari, F., and Zukotynski, S., J.Appl.Phys. 78, 5307 (1995).Google Scholar
15. Fracture, Lawn B. of Brittle Solids, Second Edition, Cambridge University Press, 1993 Google Scholar
16. Pharr, G.M., Harding, D.S., and Oliver, W.C. (1993), in Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures (Nastasi, M., Parkin, D.M., and Gleiter, H., eds.0, pp. 449–461, Kluwer Academic Publishers, Dorddrecht, The Nitherlands.Google Scholar
17. Dorfinan, Benjamin. F., Mater. Res. Soc. Meeting, Boston, Unpublished (1996) V. 1.6Google Scholar