Hostname: page-component-8448b6f56d-sxzjt Total loading time: 0 Render date: 2024-04-18T20:29:42.717Z Has data issue: false hasContentIssue false

Influence of Bottom Contact Material on the Selective Chemical Vapor Deposition of Crystalline GeSbTe Alloys

Published online by Cambridge University Press:  01 February 2011

Alejandro Schrott
Affiliation:
schrott@us.ibm.com, IBM Research, Yorktown heights, New York, United States
Chieh-Fang Chen
Affiliation:
jfchen@mxic.com.tw, Macronix Emerging Central Laboratory, Macronix International Co., Ltd., Hsin-chu, Taiwan, Province of China
Matthew J. Breitwisch
Affiliation:
breitm@us.ibm.com, IBM Research, Yorktown Heights, New York, United States
Eric A. Joseph
Affiliation:
ejoseph@us.ibm.com, IBM Research, Yorktown heights, New York, United States
Ravi K Dasaka
Affiliation:
rkdasaka@us.ibm.com, United States
Roger W. Cheek
Affiliation:
cheekrw@us.ibm.com, IBM Research, Yorktown Heights, New York, United States
Yu Zhu
Affiliation:
yuzhu@us.ibm.com, IBM Research, Yorktown Heights, New York, United States
Chung H Lam
Affiliation:
clam@us.ibm.com, IBM, Research, 1101 Kitchawan Rd, PO Box 218, Yorktown Heights, New York, 10598, United States
Get access

Abstract

Selective Chemical Vapor Deposition of Crystalline Ge-Sb-Te alloys initiating at the bottom metal contact of vias of various sizes has been accomplished. The method is based on selecting Sb and Te precursors which do not decompose on dielectric surfaces in the utilized temperature range.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Lee, J. Choi, S. , Lee, C. , Kang, Y. Kim, D. , Ap Appl. Surf. Sci 253, 3969 (2007).Google Scholar
2 Kim, R.Y. Kim, H.G. Yoon, S.G. App.Phys. Lett. 89, 102107 (2006).Google Scholar
3 Choi, B.J. Choi, S. Shin, Y.C. Hwang, C. S. Lee, J. W. Jeong, J. Kim, Y. J. Hwang, S.Y., Hong, S. K. J. Electrochem. Soc., 154, H318 (2007)Google Scholar
4 Chen, P.S. Hunks, W.J. Stender, M. Chen, T. Stauf, G. T. Xu, C. and Roeder, J. F. Mater. Res. Soc. Symp. Proc. Vol. 1071 2008 Materials Research Society.Google Scholar
5 Choi, B.J., Oh, S. H. Choi, S. Eom, T. Shin, Y. C.., Kim, K. M. Yi, K.W. Hwang, C. S.z Kim, Y. J. Park, H. C. Baek, T. S. and Hong, S. K. Journal of The Electrochemical Society, 156, H59 (2009).Google Scholar
6 Ritalaa, M. Pore, V. Hatanpää, T., Heikkilä, M., Leskelä, M., Mizohatab, K. Schrott, A. Raoux, S. and Rossnagel, Stephen M. Microelectronic Engineering, 86, 1946 (2009).Google Scholar
7 Okubo, S., Yanagita, K. and Gatineau, J. in Tellurium Precursors for film deposition, US Pat. App. US 2009/0299084A1, (2009)Google Scholar
8 Friedrich, I., Weidenhof, V. Njoroge, W. Franz, P. and Wuttig, M. J. Appl. Phys. 87, 4130 (2000).Google Scholar
9 Lencer, D. Salinga, M. BGrabowski, l. Hickel, T. Neugebauer, J. and Wuttig, M. Nature Materials 7, 972977 (2008).Google Scholar