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In-Situannealing Transmission Electron Microscopy(Tem) Study of the Ti/GaAs Interfacial Reactions

Published online by Cambridge University Press:  25 February 2011

Ki-Bum Kim
Affiliation:
Philips Research Laboratories Sunnyvale, Signetics Company, Sunnyvale, CA 94088-3409
Robert Sinclair
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

In-situ annealing TEM experiments were performed on the Ti/GaAs system in order to study the dynamic behavior of interfacial reactions. Both plan-view and cross-sectional samples were investigated in either diffraction and imaging (both conventional and high resolution) modes. During experiments, we observed the following: (a) At the initial stage of reaction, the TiAs phase formed at the original Ti/GaAs interface with a distinct orientation with respect to the substrate; (b) as the reaction proceeded, the TiAs phase formed in a random manner; (c) finally, the liberated Ga species from the GaAs diffused out to the metal film and formed TiGa2 phase in the plan-view sample similar to the furnace-annealed case. For the cross-sectional sample, however, we did not observe any Ti:Ga phase formation. Instead, we observed the formation of voids both in the Ti film and in the GaAs substrate. The formation of different microstructure between in-situ and furnace annealed cases is explained by the sample geometry during annealing.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

1. Sinha, A.K. and Poate, J.M., in Thin Films-Interdiffusion and Reactions, edited by Poate, J.M., Tu, K.N, and Meyer, J.W. (Wiley-Interscience, New York, 1978), Chap. 11Google Scholar
2. Palmstrom, C.J. and Morgan, D.V., in Gallium Arsenide- Materials, Devices, and Circuits, edited by Howes, M.J. and Morgan, D.V. (Wiley-Interscience, New York, 1985), Chap. 6Google Scholar
3. Beyers, R., Kim, K.B., and Sinclair, R., J. Appl. Phys. 61, 2195 (1987)CrossRefGoogle Scholar
4. Kim, K.B., Kniffin, M., Sinclair, R., and Helms, C.R., J. Vac. Sci. and Technol. A6, 1473 (1988)CrossRefGoogle Scholar
5. Bravman, J.C. and Sinclair, R., J. Electron. Microsc. Technol. 1, 53 (1984)Google Scholar
6. Sinclair, R., Parker, M.A., and Kim, K.B., Ultramicroscopy 23, 383 (1988)CrossRefGoogle Scholar
7. Sinclair, R., Yamashita, T., Parker, M.A., Kim, K.B., Holloway, K., and Schwartzman, A.F., Acta Crystal. A44, 965 (1988)Google Scholar
8. Fontaine, C., Okumura, T., and Tu, K.N., J. Appl. Phys. 54, 1404 (1983)Google Scholar
9. Lahav, A., Eizenberg, M., and Komem, Y., J. Appl. Phys. 60, 991 (1986)Google Scholar
10. Yu, K.M., Sands, T., Jaklevic, J.M., and Haller, E.E., J. Appl. Phys. 62, 1815 (1987)Google Scholar
11. Sands, T., Keramidas, V.G., Yu, K.M., Washburn, J., and Krishnan, K., J. Appl. Phys. 62, 2070 (1987)CrossRefGoogle Scholar
12. Oelhafen, P., Freeouf, J.L., Kuan, T.S., Jackson, T.N., and Batson, P.E., J. Vac. Sci. and Technol. B1, 588 (1983)CrossRefGoogle Scholar
13. Ogawa, M., Thin Solid Films 70, 181 (1980)CrossRefGoogle Scholar
14. Lahav, A., Eizenberg, M., and Komem, Y., Mat. Res. Soc. Symp. Proc. 37, 641 (1985)Google Scholar
15. Sands, T., Keramidas, V.G., Yu, A.J., Yu, K.M., Gronsky, R., and Washburn, J., J. Mat. Res. 2, 262 (1987)Google Scholar
16. Lahav, A., Eizenberg, M., and Komem, Y., J. Appl. Phys. 62, 1768 (1987)Google Scholar
17. Kuan, T.S., Freeouf, J.L., Batson, P.E., and Wilkie, E.L., J. Appl. Phys. 58, 1519 (1985)Google Scholar