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Measuring the Adhesion of Diamond Thin Films to Substrates Using the Blister Test

Published online by Cambridge University Press:  15 February 2011

Jim Sizemore ,
R. J. Hohlfelder ,
J. J. Vlassak  and
W. D. Nix
Jim Sizemore
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
R. J. Hohlfelder
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
J. J. Vlassak
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
W. D. Nix
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
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Abstract

It is shown that the blister testing technique can be used to measure the adhesion of thin films to their substrates. A brief discussion of blister test mechanics is presented here, leading to a simple equation relating adhesion to the height of the blister and the pressure causing it to grow. Blister test data for plasma-enhanced CVD diamond films on Si substrates have been analyzed using this relation. The tests show adhesion energies of 1.8– 2.6 J/m2.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 383: Symposium I – Mechanical Behavior of Diamond and Other Forms of Carbon , 1995 , 197
Copyright
Copyright © Materials Research Society 1995

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References

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