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Microchannel Arrays in Borophosphosilicate Glass for Photonic Device and Optical Sensor Applications

Published online by Cambridge University Press:  01 February 2011

Claire L. Callender ,
Patrick Dumais ,
Chantal Blanchetière ,
Christopher J. Ledderhof  and
Julian P. Noad
Claire L. Callender
Affiliation:
Communications Research Centre, PO Box 11490, Station H, Ottawa, Ontario, Canada K2H 8S2
Patrick Dumais
Affiliation:
Communications Research Centre, PO Box 11490, Station H, Ottawa, Ontario, Canada K2H 8S2
Chantal Blanchetière
Affiliation:
Communications Research Centre, PO Box 11490, Station H, Ottawa, Ontario, Canada K2H 8S2
Christopher J. Ledderhof
Affiliation:
Communications Research Centre, PO Box 11490, Station H, Ottawa, Ontario, Canada K2H 8S2
Julian P. Noad
Affiliation:
Communications Research Centre, PO Box 11490, Station H, Ottawa, Ontario, Canada K2H 8S2
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Abstract

The fabrication of two-dimensional uniform arrays of microchannels in borophosphosilicate glass (BPSG) layers deposited by plasma-enhanced chemical vapor deposition (PECVD) is presented. The microchannels, with circular cross-sections of 2-3 μm diameter, are formed by depositing specific thicknesses of BPSG over periodic ridge/space templates etched into underlying silica layers using reactive ion etching (RIE). High temperature annealing results in reflow of the BPSG and the formation of uniform circular or cylindrical voids between the template ridges. Control of microchannel size and geometry through process variables is reported, and exploitation of the microfluidic and optical properties of microchannels and integrated waveguides for applications in optical sensing and photonic devices is demonstrated

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 872: Symposium J – Micro- and Nanosystems—Materials and Devices , 2005 , J16.3
Copyright
Copyright © Materials Research Society 2005

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References

1 Giordano, N. and Cheng, J.-T., J. Phys.:Condens. Matter 13, R271–R295 (2001).Google Scholar
2 Runyan, W.R. and Bean, K.E., “Semiconductor Integrated Circuit Processing Technology”, Addison-Wesley (1990).Google Scholar
3 Ou, H., Electron. Lett., 39(2) 212–213 (2003).Google Scholar
4 Callender, C.L., Ledderhof, C.J., Dumais, P., Blanchetière, C., and Noad, J.P., J. Mat. Res. 20 (3), 759–764 (2005).Google Scholar
5 Birks, T. A., Knight, J. C., Russell, P. St.J., Optics Lett., 22(13), 961–963 (1997).Google Scholar
6 Dumais, P., Callender, C.L., Noad, J.P. and Ledderhof, C.J., Photonics Technol. Lett., 17(2), 441–443 (2005).Google Scholar