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Micromechanics Measurements Applied to Integrated Circuit Microelectronics

  • David R. Clarke (a1)

Abstract

As in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

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7. Wen, Q., PhD Thesis, University of California, Santa Barbara (1996).
8. Bagchi, A., Lucas, G. E., Suo, Z. and Evans, A. G., A new procedure for measuring the decohesion energy for thin ductile films on substrates. J. Mater. Res. 9 17341741 (1994).
9. Xu, G., Ragan, D. D., Clarke, D. R., He, M. Y., Ma, Q. and Fujimoto, H., Measurement of the Fracture Energy of SiO2/TiN Interfaces Using the Residually-Stressed Thin-Film Micro-Strip Test, Mater. Res. Soc. Symp. Proc., 458 In Press.
10. Ma, Q., Fujimoto, H., Flinn, P., Jain, V., Adibi-Rizi, F., Moghadam, F. and Dauskardt, R., Quantitative measurement of interface fracture energy in multilayer thin-film structures. Mater. Res. Soc. Symp. Proc., 391 9196 (1995).
11. He, M. Y., Xu, G., Clarke, D. R., Ma, Q. and Fujimoto, H., The Energy Release Rate for Decohesion in Thin Multilayered Films on Substrates, These proceedings.
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
  • URL: /core/journals/mrs-online-proceedings-library-archive
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