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Microstructural Evolution of Cu/Ta/GaAs Multilayers with Thermal Annealing

Published online by Cambridge University Press:  01 February 2011

Wei-Cheng Wu ,
Chang-You Chen ,
Chen-Shih Lee ,
Edward Yi Chang  and
Li Chang
Wei-Cheng Wu
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Tawain 300, Republic of China
Chang-You Chen
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Tawain 300, Republic of China
Chen-Shih Lee
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Tawain 300, Republic of China
Edward Yi Chang
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Tawain 300, Republic of China
Li Chang
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Tawain 300, Republic of China
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Abstract

Copper metallization for GaAs was evaluated by using Cu/Ta/GaAs multilayers for its thermal stability. A thin Ta layer of 30 nm thickness was sputtered on the GaAs substrate as the diffusion barrier before copper film metallization. As judged from the results of sheet resistance, X-ray diffraction, Auger electron spectroscopy and transmission electron microscopy, the Cu/Ta films on GaAs were very stable up to 500 °C without Cu migration into GaAs. After 550 °C annealing, the interfacial mixing of Ta with GaAs substrate occurred, resulting in the formation of TaGa2 and TaAs2, and the diffusion of Ga and As through the Ta layer formed the Cu3Ga and Cu3As phases at the Cu/Ta interface. After 600 °C annealing, the reaction of GaAs with Ta and Cu formed TaAs and Cu3Ga, as a result of Cu migration and interfacial instability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 783: Symposium B – Materials, Intergration, and Packaging Issues for High-Frequency Devices , 2003 , B7.2
Copyright
Copyright © Materials Research Society 2004

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References

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