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Modeling the Low Cycle Fatigue in Copper Single Crystal: Multiscale Dislocation Dynamics Simulations

Published online by Cambridge University Press:  05 April 2013

Micheal Kattoura
Affiliation:
Mechanical Engineering Department, American University of Beirut, Beirut, Lebanon
Mutasem Shehadeh
Affiliation:
Mechanical Engineering Department, American University of Beirut, Beirut, Lebanon
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Abstract

Multiscale dislocation dynamics plasticity (MDDP) model is used to investigate the evolution of dislocation microstructure in copper single crystals subjected to low cycle fatigue loading. Half cycle total plastic strain simulations are carried out at strain amplitudes ranging from 1×10-3 to 8×10-3. The initial hardening is investigated and the micro-structural cause behind it is presented. In addition, the loading history is presented and the effect of the initial micro-structure and dislocation distribution on the hardening behavior is studied. In addition, the evolution of the microstructures is examined. In depth analyses of the dislocation microstructures show that: 1) dislocation planes that are parallel and very close to each other are formed, 2) these walls contain dipoles that keep on zipping and unzipping during the first few cycles until they reach some stable zipping configuration. We can see that the hardening rate decreases with the increase of the number of cycles where we have large hardening rate in the first cycles then we reach to somehow constant stress. Our results are qualitatively in good agreement with recent experimental results of low cycle fatigue deformation.

Type
Articles
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Suresh, S., Fatigue of Materials, Cambridge University Press, 1999.Google Scholar
Basinski, Z. S., Basinski, S. J., Progr. Mater. Sci. 36 (1992) p. 89.CrossRefGoogle Scholar
Li, P., Li, S.X., Wang, Z.G., Zhang, Z.F., Mater. Sci. Eng. A 23 (2010) p. 6244.CrossRefGoogle Scholar
Mughrabi, H., Mater. Sci. Eng. A 33 (1977) p.207.CrossRefGoogle Scholar
Jia, Y., Morrison, D.J., Moosbrugger, J.C., Mater. Sci. Eng. A 492 (2008) p.80.CrossRefGoogle Scholar
Yi, J.Z., Torbet, C.J., Feng, Q., Pollock, T.M., Jones, J.W., Mater. Sci. Eng. A 443 (2007) p.142.Google Scholar
Flouriot, S., Forest, S., Rémy, L., Comp. Mater. Sci. 26 (2003) p. 61.CrossRefGoogle Scholar
Hanriot, F., Gailletaud, G., Rémy, L., Proc. Int. Conf. High. Temp. Constitutive Modeling 16 (1991), p. 139.Google Scholar
Finney, J.M., and Laird, C., Phil. Mag. 31 (1975) p.339.CrossRefGoogle Scholar
Hahner, P., Tippelt, B., Holste, C., Acta. Metall. 46 (1998) p. 5073.Google Scholar
Weng, G. J., Int. J. Solid Struct. 15 (1979) p.861.CrossRefGoogle Scholar
Potirniche, G.P., Daniewicz, S.R., Int J Fatigue 25 (2003) p.877.CrossRefGoogle Scholar
Zhou, D., Moosbrugger, J.C., Morrison, D.J., Int. J. Plast. 22 (2006) p.1336.CrossRefGoogle Scholar
Horstemeyer, M.F., Farkas, D., Kim, S., Tang, T., Potirniche, G., Int J Fatigue 32 (2010) p. 1473.CrossRefGoogle Scholar
Fivel, M. C., C. R. Physique, 9 (2008), p. 427 CrossRefGoogle Scholar
Yang, J., Li, Y., Li, S., Ma, C., Li, G., Mater. Sci. Eng. A 299 (2001) p.51.CrossRefGoogle Scholar
Zbib, H.M. and de la Rubia, T.D., Int. J. Plast. 18 (2002) p.1133.Google Scholar
Shehadeh, M.A., Zbib, H.M. and de la Rubia, T.D., Int. J. Plast. 21 (2005) p.2369.CrossRefGoogle Scholar
Shehadeh, M.A. Phil. Mag. 92 (2012) p.1173.CrossRefGoogle Scholar
Hirth, J.P., Zbib, H.M. and Lothe, J., Model. Simulat. Mater. Sci. Eng. 6 (1998) p.165.CrossRefGoogle Scholar