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Pad Conditioning and Pad Surface Characterization in Oxide Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

A. Scott Lawing
A. Scott Lawing*
Affiliation:
Rodel, Inc., 3804 East Watkins Street, Phoenix, AZ 85034
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Abstract

An understanding of the pad surface state and its effect on the polishing process is critical to a more fundamental understanding of Chemical Mechanical Polishing (CMP). Vertical Scanning Interferometry has been shown to be a useful tool to monitor the pad surface state. In this paper, various techniques for analyzing pad surface data obtained using interferometry are described. The pad surface state can be modified through the manipulation of process and pad conditioner design parameters. Many of the parameters extracted from interferometry data show strong correlations with corresponding polish data. A careful analysis of these complementary data can yield significant insight into the mechanisms of CMP processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 732: Symposium I – Chemical-Mechanical Planarization , 2002 , I5.3
Copyright
Copyright © Materials Research Society 2002

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