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The Reaction Kinetics of Liquid 60/40 Sn/Pb Solder With Copper and Nickel: A High Temperature X-Ray Diffraction Study

Published online by Cambridge University Press:  22 February 2011

Patrick W. Dehaven
Patrick W. Dehaven*
Affiliation:
IBM Corporation, Zip 41C, Route 52, Hopewell Junction, NY 12533
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Abstract

With proper sample preparation, high temperature x-ray diffraction can be used to study in-situ the reactions occurring at a solder/metal interface. We have applied this technique to an investigation of the reaction kinetics between copper and nickel metal and 60/40 Sn/Pb solder. The copper and nickel are shown to follow similar pathways, each having a complex reaction profile that involves an initial “hold” of little reactivity, followed by a two-step diffusion controlled reaction. Activation energies were obtained from Arrhenius-type plots, and result in values of 6.8 kcal/mole for the nickel/solder reaction, and 13 kcal/mole for the copper/solder reaction. These results are compared with those obtained by previous investigators, and discussed in terms of the growth of the different intermetallic phases.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 123
Copyright
Copyright © Materials Research Society 1985

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