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Residual Stress Measurement in a Pt-Aluminide Bond Coat

Published online by Cambridge University Press:  21 March 2011

Makoto Watanabe ,
Daniel R. Mumm ,
Stefanie Chiras  and
Anthony G. Evans
Makoto Watanabe
Affiliation:
Princeton Materials Institute, Princeton University, Princeton, NJ 08540-5211, U.S.A.
Daniel R. Mumm
Affiliation:
Princeton Materials Institute, Princeton University, Princeton, NJ 08540-5211, U.S.A.
Stefanie Chiras
Affiliation:
Princeton Materials Institute, Princeton University, Princeton, NJ 08540-5211, U.S.A.
Anthony G. Evans
Affiliation:
Princeton Materials Institute, Princeton University, Princeton, NJ 08540-5211, U.S.A.
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Abstract

The residual stress induced in a Pt-aluminide bond coat formed on a single-crystal superalloy has been measured. The stresses arise because of the thermal expansion misfit with the substrate on cooling from the manufacturing temperature. Since the lattice parameters are unknown, the interpretation of diffraction measurements is problematic, and the “wafer” curvature method has been applied. This method required that the substrate thickness be systematically reduced by mechanical thinning. It was also required that curvature measurements be made with the bond coat present as well as after it had been removed by thinning. This approach revealed that the bond coat is in residual tension, 140MPa, consistent with its thermal expansion coefficient, relative to that for the substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L6.14.1
Copyright
Copyright © Materials Research Society 2002

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References

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