Hostname: page-component-8448b6f56d-gtxcr Total loading time: 0 Render date: 2024-04-23T22:50:47.062Z Has data issue: false hasContentIssue false

Roles of Primary Hot Hole and FN Electron Fluences in Gate Oxide Breakdown

Published online by Cambridge University Press:  10 February 2011

M. F. Li
Affiliation:
Center for Integrated Circuit Failure Analysis and Reliability, Department of Electrical Engineering, National University of Singapore, Singapore, 119260
Y. D. He
Affiliation:
Center for Integrated Circuit Failure Analysis and Reliability, Department of Electrical Engineering, National University of Singapore, Singapore, 119260
S. G. Ma
Affiliation:
Center for Integrated Circuit Failure Analysis and Reliability, Department of Electrical Engineering, National University of Singapore, Singapore, 119260
Byung Jin Cho
Affiliation:
Center for Integrated Circuit Failure Analysis and Reliability, Department of Electrical Engineering, National University of Singapore, Singapore, 119260
K. F. Lo
Affiliation:
Chartered Semiconductors Manufacturing Pte. Ltd, Singapore, 738406
Get access

Abstract

In this work, we report the link between the primary hot hole and Fowler Nordheim (FN) electron injections in oxide breakdown mechanism. A simple breakdown model is established. The experimental method is carefully designed to measure the primary hot hole fluence and FN electron fluence separately and accurately. The calculation based on our model is in very good agreement with our experiments. Oxide breakdown is stimulated by a combined effect when the sum of the trap density Dpri activated by primary hot hole injection and the trap density Dn activated by FN electron injection reaches a critical value Dcri. The hole is two orders of magnitude more effective than FN electron in causing breakdown. Since primary hot hole injection may occurs under many realistic device operation in the circuit, existing oxide lifetime projected from conventional TDDB measurement by only applying FN stress is overestimated in many cases. The model demonstrated in this work lays the groundwork in approaching a more appropriate way for predicting the oxide reliability and lifetime.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Harari, E., J. Appl. Phys., 49, p.2478, (1978).Google Scholar
2.Chen, I. C., Holland, S E. and Hu, C., IEEE Trans. Electron Devices, 32, p.413,(1985)Google Scholar
3.Schuegraf, K. F. and Hu, C., IEEE Trans. Electron Devices, 41, p.761, (1994).Google Scholar
4. The FN electron induced hole current in MOSFET was first observed in 1980 as illustrated in Weinberg and Fischetti, J.Appl.Phys., 57, p. 443 (1985). Sah et al has given a comprehensive analysis of the physical original of this FN electron induced hole current in Chih-Tang Sah, Fundamentals of Solid-State Electronics, Study Guide, Appendix B, World Scientific, (1993) and Yi Lu and C. T. Sah, J Appl. Phys. 76, p. 4724, (1994); Phys. Rev. 52, p. 5657, (1995), and they used the terminology “secondary hole”.Google Scholar
5.Weinberg, Z. A. and Nguyen, T. N., J. Appl. Phys. 61, p.1947, (1987).Google Scholar
6.Arnold, D., Cartier, E. and DiMaria, D.J., Phys. Rev.B, 49, p. 1027810297, (1994).Google Scholar
7.Satake, H., Takagi, S. and Toriumi, A., Proc. IRPS, p. 156163, (1997).Google Scholar
8.Kamakura, Y., Utsunomiya, H., Tomita, T., Umeda, K. and Taniguchi, K., IEDM, Tech. Digest, p. 8184, (1997).Google Scholar
9.Sah, C. T. and Nishida, T., 21st Int. Conf. The Physics of Semiconductors, 1, p. 2840, (1992).Google Scholar
10.Ning, T. H. and Yu, H. N., J. Appl. Phys.,. 45, p. 53735378, (1974).Google Scholar
11.Maria, D.J., Cartier, E. and Buchanan, D.A., J. Appl. Phys., 80, p. 304317, (1996).Google Scholar
12. We are indebted to Professor Sah, C. T. who pointed out to us that the kinetic energy of holes in the oxide may not high enough to generate new oxide traps. We therefore use “activate” to replace “generate” traps.Google Scholar
13.Dumin, D. J., Madux, J. R., Scott, R. S. and Subramonioum, R., IEEE Trans. Electron Devices, 41, p. 15701580, (1994).Google Scholar
14.Apte, P. P., Saraswat, K. C., IEEE Trans. Electron Devices, 41, p. 1595, (1994).Google Scholar
15.Nissan-Cohen, Y., Shappir, J. and Frohman-Bentchkowsky, D., J. Appl. Phys., 60, p. 20242035, (1986).Google Scholar
16.Woltjer, R., Paulzen, G.M., Pomp, H.G., Lifka, H. and Woerlee, P.H., IEEE Trans. Electron Devices, 42, p. 109115,(1995).Google Scholar
17.Tsuchiya, T., Okazaki, Y., Miyake, M. and Kobayashi, T., Extend Abstract 22nd SSDM, Sendai, p.291294 (1990).Google Scholar