Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-25T17:52:47.128Z Has data issue: false hasContentIssue false

Single-Crystal Thin Film Transistor by Grain-Filter Location-Controlled Excimer-Laser Crystallization

Published online by Cambridge University Press:  17 March 2011

Barry D. van Dijk
Affiliation:
Delft University of Technology, DIMES, Feldmannweg17, 2628 CT DELFT, The Netherlands, B.D.vandijk@dimes.tudelft.nl
Paul Ch. Van der Wilt
Affiliation:
Delft University of Technology, DIMES, Feldmannweg17, 2628 CT DELFT, The Netherlands
G. J. Bertens
Affiliation:
Delft University of Technology, DIMES, Feldmannweg17, 2628 CT DELFT, The Netherlands
Lis.K. Nanver
Affiliation:
Delft University of Technology, DIMES, Feldmannweg17, 2628 CT DELFT, The Netherlands
Ryoichi Ishihara
Affiliation:
Delft University of Technology, DIMES, Feldmannweg17, 2628 CT DELFT, The Netherlands
Get access

Abstract

Thin film transistors (TFTs) are fabricated inside a large, location-controlled, silicon grain, fabricated with the grain-filter method. In a first experiment TFTs with high field-effect mobility for electrons of 430 cm2/Vs are fabricated. The off-current and subthreshold swing have high values of 60 pA and 1.2 V/dec, respectively. The grain-filter is improved by doping the channel and by planarizing the grain-filter by chemical mechanical polishing (CMP). TFTs fabricated in CMP-planarized grain-filters have mobility, off-current, and subthreshold swing of 430 cm2/Vs, 0.3 pA, and 0.29 V/dec, respectively, which compares well with the characteristics for SOI TFTs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ishihara, R. and Matsumura, M., Electron. Letters 22, 1956 (1995).Google Scholar
2. Yamauchi, N., Hajjar, J.J.J., and Reif, R., IEEE Trans. Electron Devices 38, 58 (1991).Google Scholar
3. Wang, H., Chan, M., Jagar, S., Poon, V.M.C., Qin, M., Wang, Y., and Ko, P.K., IEEE Trans. Elec. Dev. 47, 1580 (2000).Google Scholar
4. Crowder, M.A., Carey, P.G., Smith, P.M., Sposili, R.S., Cho, H.S., and Im, J.S., IEEE Electron Device Lett. 19, 306 (1998).Google Scholar
5. Wilt, P.Ch. van der, Ishihara, R., and Bertens, G.J. presented at the 2000 MRS Spring Meeting, Q7.4, San Francisco, CA, (to be published).Google Scholar
6. Wilt, P.Ch. van der. 2001 MRS Spring Meeting, D5.20, San Francisco, CA, (to be published).Google Scholar
7. Cullus, A.G., Chew, N.G., Webber, H.C., and Smith, D.J., J. Cryst. Growth 68 (1981) 624.Google Scholar