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The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect

  • Hyo-Jong Lee (a1), Heung Nam Han (a2), Suk Hoon Kang (a3), Jeong-Yun Sun (a4) and Kyu Hwan Oh (a5)...


In a crystallographic study of stress induced voiding of copper interconnect, the planar electron backscattered diffraction analysis showed that the void was initiated at the triple junction of the grain boundaries, not at the junction of the twin boundary and grain boundary. By using stepwise cross-sectional crystalline investigation for the void, it was possible to rebuild 3D crystalline structure near the void. From the stress calculation based on the measured crystalline structures, the hydrostatic stress was highly concentrated at the triple junction of the twin boundary and grain boundary, but experimentally, there was no voiding at that. The voiding in the copper interconnect may depend mainly on the boundary instability.



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2 Lee, Sun-Jung, Lee, Soo-Geun, Suh, Bong-Suk, Shin, Hongjae, Lee, Nae- In, Kang, Ho-Kyu and Suh, Gwangpyuk, Proceedings of IEEE International Interconnect Technology Conference, 2005, p. 108.
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6 Lee, Hyo-Jong, Kim, Dong Ik, Ahn, Jeong Hun and Lee, Dong Nyung, Thin Solid Films 474, 250 (2005).
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  • EISSN: 1946-4274
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