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Templating Nanopores Into Poly(MethylSilsesquioxane): New Lowdielectric Coatings Suitable for MicroElectronic Applications

Published online by Cambridge University Press:  10 February 2011

Julius F. Remenar
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Craig J. Hawker
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
James L. Hedrick
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Sung Mog Kim
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Robert D. Miller
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Cattien Nguyen
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Mikael Trollsås
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
Do Y. Yoon
Affiliation:
Center on Polymer Interfaces and Macromolecular Assemblies, IBM Almaden Research Center, San Jose, CA, 95120.
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Abstract

Thin films of nanoporous poly(methylsilsesquioxane) have been prepared from organic/inorganic polymer hybrids. Low molecular weight 6-arm star poly(caprolactone)s are incorporated into partially pre-condensed methylsilsesquioxane resin. Upon heating, the glass resin cross-links around the organic polymer templates. Thermal decomposition of the orgainc polymer produces nanoporous thin films which show tunable dielectric constants as low as 1.9 and exhibit properties suitable for use in interconnect devices. Experimental data including porosity, morphology, and dielectric constants are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

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