This paper introduces the Polylmide-Ceramic substrate for NEC SX Supercomputers. In case of high performance system such as supercomputers and top end machines in general purpose computer, sophisticated packaging technologies are essential to achieve fastest operations as well as to use highestspeed, highly integrated LSIs.
Wiring substrate which mounts and interconnects LSIs is the key to back up LSI's higher logical-operations.
The high speed interconnection wirings and high density LSI mounting are requested for substrate.
The Polyimide-Ceramic substrate had been developed to meet these demands and have many features of high density thin film wiring, high power supply, high thermal conductivity and huge number of I/Os, in addition to high speed wiring.
25μm wide 75μm center-to-center spacing, two signal layers, 6ns/m signal transmissions, 2.5W/cm2 high power density, 2177 I/Os on a 100mm square substrate have been achieved by using this super substrate technology.
The packaging hierarchy, the first level packaging of TAB LSI, the second level of multi-chip packaging by using Polyimide-Ceramic substrate and liquid cooling module, and the third level of board assemblies are introduced.