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X-ray diffraction imaging of dislocation generation related to microcracks in Si wafers

  • J. Wittge (a1), A. Danilewsky (a1), D. Allen (a2), P. McNally (a2), Z. J. Li (a3), T. Baumbach (a3), E. Gorostegui-Colinas (a4), J. Garagorri (a4), M. R. Elizalde (a4), D. Jacques (a5), M. C. Fossati (a6), D. K. Bowen (a6) and B. K. Tanner (a6)...

The nucleation of dislocations at indents in silicon following rapid thermal annealing (RTA) has been examined by X-ray diffraction imaging (topography). For indentation loads below 200 mN, no slip bands were generated from the indent sites following RTA at 1000 °C under spike conditions. Upon plateau annealing at 1000 °C, slip dislocations were propagated from some indents but not all. Slip was also observed from edge defects not associated with indentation. For 500-mN indentation load, large scale dislocation sources were generated from the indent sites propagating on two of the four {111} slip planes. These dislocations multiplied into macroscopic-scale slip bands. A significant change in morphology was observed in the 60° dislocation segments after the screw segment reached the rear surface of the wafer. Dislocations changed line direction and in some cases appeared to leave the Peierls trough during glide.

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Powder Diffraction
  • ISSN: 0885-7156
  • EISSN: 1945-7413
  • URL: /core/journals/powder-diffraction
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