Hostname: page-component-76fb5796d-9pm4c Total loading time: 0 Render date: 2024-04-25T11:20:23.317Z Has data issue: false hasContentIssue false
  • English
  • Français

Compliant MEMS Motion Characterization by Nanoindentation

Published online by Cambridge University Press:  01 February 2011

Joseph Choueifati ,
Craig Lusk ,
Xialou Pang  and
Alex A. Volinsky
Joseph Choueifati
Affiliation:
joseph_choueifati@hotmail.com, USF, Mechanical engineering, 8413 maple flower lane, tampa, FL, 33614, United States
Craig Lusk
Affiliation:
clusk2@eng.usf.edu, University of South Florida, Mechanical Engineering, Tampa, FL, 33620, United States
Xialou Pang
Affiliation:
xiaolupang@gmail.com, University of South Florida, Mechanical Engineering, Tampa, FL, 33620, United States
Alex A. Volinsky
Affiliation:
volinsky@eng.usf.edu, University of South Florida, Mechanical Engineering, Tampa, FL, 33620, United States
Get access

Abstract

Large out-of-plane displacements can be achieved when compliant mechanisms are utilized in MEMS. While mathematical and macroscopic modeling is helpful in building original designs, the actual MEMS device motion needs to be characterized in terms of the forces and displacements. A nanoindentation apparatus equipped with Berkovich diamond tip was used in an attempt to actuate and characterize the motion of the Bistable Spherical Compliant Micromechanism with a nonlinear (approximately cubic) mechanical response. Based on the obtained lateral force-displacement data it was concluded that the Berkovich diamond tip was too sharp, thus cutting through the polysilicon material of the MEMS device.

Keywords

microelectro-mechanical (MEMS)fracturestrength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD06-24
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Gabriel, K. J., “Microelectromechanical Systems (MEMS) Tutorial”, IEEE Test Conference (TC), 432–441 (1998).Google Scholar
2 Mehregany, M. and Huff, M., “Microelectromechanical Systems”, Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 9–18 (1995).Google Scholar
3 Lusk, C., “Ortho-Planar Mechanisms for Microelctromechanical Systems”, Ph.D. Dissertation, Brigham Young University, Provo, UT (2005).Google Scholar
4 Lam, A.H.F, Li, W.J., Liu, Yunhui; Xi, Ning, 2002) IEEE/RSJ International Conference on Intelligent Robots and System, vol. 2, 1184–1189 (2002).Google Scholar
5 Fukushige, T., Hata, S., Shimokohbe, A., Journal of Microelectromechanical Systems 14(2) 243–253 (2005).Google Scholar
6 Ananthasuresh, G.K, Howell, L.L, , Larry, Journal of Mechanical Design 127(4) 736–738 (2005).Google Scholar
7 Felton, B., “Better Robots Through Clean Living”, Intec, May 2001).Google Scholar
8 Cragun, R. and Howell, L. L., “A New Constrained Thermal Expansion Micro-Actuator”, American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC, vol. 66, 365–371 (1998).Google Scholar
9 Lott, C. D., Harb, J., McClain, T. W., Howell, L.L., Technical Proceedings of the Fourthm International Conference on Modeling and Simulation of Microsystems, MSM 2001, Hilton Head Island, South Carolina, 374–377 (2001).Google Scholar
10 Howell, L.L, Midha, A. , A., ASME Journal of Mechanical Design 116(1), 280–290 (1994).Google Scholar
11 Koester, D., Mahadevan, R., Hardy, B., and Markus, K., MUMPs Design Handbook. Research Triangle Park, NC: Cronos Integrated Microsystems (2001).Google Scholar
12 Pister, K.S.F, Judy, M.W., Burgett, S.R., Fearing, R.S., Sensors and Actuators A, 33 249–256 (1992).Google Scholar